Printed Circuit Information 2009 Issue z1 Control the ENEPIG Surface Treatment to Get the Excellent Solder Region of IC Substrate

Control the ENEPIG Surface Treatment to Get the Excellent Solder Region of IC Substrate
chen xian ming ; wu zuo jie ; bao ; chi wei xiang

..............page:231-238

How to Face CAF Risk of Systemic Board in High Density
chen jian

..............page:363-370

How to Reduce Testing Cost of Bare PCB
wu yong

..............page:352-354

The Recycle of the Condensed Water in Air-conditioning System in Printed Circuit Board Factory
shi xiu hong

..............page:528-532

Bare PCB E-Test and Laser Marking Technology
lei qun ; wu yong

..............page:344-351

The Treatment of Heavy Metal Ions in the PCB Industry Wastewater(Colloidal Pharmacy-and the Law)
yang he sheng ; yang he cun ; yang li zhi

..............page:522-527

Analysis of Plating Process Impact on Infiltration Plating
zhong zhi xin

..............page:213-216

New OSP Organic Protecting Agent for Lead-free Soldering
zhang zhi xiang

..............page:269-289

Perception on the Production Technology of the Capacitors Embedded in the Printed Circuit Board
zhang xia ; tang dao fu

..............page:471-477

Method of Manufacturing Embedded Resistor Board in Engineering
li ren tao

..............page:467-470

Characteristic on Water Absorption of Polyimide and Impact on Delamination of FPCB
xiao zheng wei ; chen zuo ; li zhi dong

..............page:426-431

The Research and Application of Mechanical Blind-hole
li pin gao ; guo xu ; zhang jian ru

..............page:134-139

Investigation on Resin Flow and Gap Filling of Coverylay in Fast-lamination
mo xin man ; chen zuo ; li zhi dong

..............page:418-425

A Study of Laser Process to RF PCB
lei qun

..............page:140-146

The Technology and Breakthroughs of X-ray Inspector in Print Circuit Board Industry
xu di hua ; liu shi qun

..............page:330-337

Test Method and Affecting Factors Analysis of Ionic Contamination Tester
yi hong kun ; li na

..............page:391-397

JPCA Standard EB-01 for Device Embedded Substrate
you jing zhao

..............page:504

Mechanism Study on PCB Expansion and Shrinkage Based on Hygrothermal Effect
ding he bin ; li yan guo ; li zhi dong

..............page:371-375

Research of High-Frequency Substrate Material and the PCB Manufacturing Technology
yuan huan xin

..............page:453-461

Different Kinds of Grain Structure of the Electroless Ni-layer and Nitric Acid Corrosion Test of Ni-layer that Grows on the Different Cu-layers
zhang wei xuan

..............page:317-323

Establishment of PCB\'s Heat-resistant Standard by T260 Test Method
lv hong gang ; wang yan mei ; wei xiong wen

..............page:508-513

Process Improvement of New Hybrid Cavity Technology
du hong bing ; li xue ming ; zeng zhi jun

..............page:444-452

The Study of Visual Inspection Machine Design Used in Printed Circuit Board Industry
wang jian ping ; xu li fen ; zhou wei wang

..............page:398-403

Cause Analysis and Improvement for the Crack of Gold Flash Product
fan ting hui

..............page:302-305

Via Quality Improvement
zhu chen

..............page:152-160

Analysis of No Copper in Blind-via Resulting in Resin Void
luo zhuo sheng ; yang bo

..............page:225-230

Suppression Parameters Optimization of Stiffener Board
ni qian feng ; yuan zheng xi ; he wei ; he bo ; chen lang ; mo zuo zuo

..............page:432-435

ERP Information Used In Improving Multilayer PCB Registration Capability
cui rong ; wang cheng yong

..............page:540-543

A Test Method Research on Evaluation of the Toughness of Copper Clad Laminate
lv ji ; chen yu e ; su xiao sheng ; li yuan

..............page:514-516

The CAF Failure Analysis Method
zhang pan xin ; yan ze jun

..............page:505-507

Synthesized and Property Researched of Conductive Polyaniline to All Printed Circuit
hong dun hua ; su xin hong ; wang shou xu ; yang ying

..............page:462-466

HAL Parameter Effect for Homogeneity of Tin Surface
liu bao lin

..............page:294-301

Analysis and Reform on Non Symmetry Structure PCB
zuo zuo

..............page:499-503

Study on Plating Parameters of HDI Board with High Aspect Ratio Micro-Via
li qin yuan ; lv hong gang ; liu pan

..............page:217-224

Investigation on Curing Kinetics and Lamination Properties of No-Flow Prepreg
mo xin man ; chen zuo ; li zhi dong

..............page:89-95

The Research of Production Efficiency and Management Methods
hu chang zhong ; chen zheng qing ; si peng bo

..............page:544-549

The Useful Exploration of Making Project Documents under the Limited Situation
lin zheng jie

..............page:563-567

The Research of Plating Copper Diffusion
liu zuo ; feng chuan chao

..............page:177-185

Test Laminate Performance by Using TMA
wen hai zhou ; ma zhi bin

..............page:404-410

The Market Analysis of PCB in China
zhou gang

..............page:11-19

Environmental Achievement Study based on the Management of Cleaner Production
zhong guan zuo ; li qin yuan ; ye zu sheng

..............page:533-539

Analysis of Energy Saving of the Fresh Air-handling Independent Mode
xie qiu ping

..............page:517-521

Film Size Change Study in the Production Process
guo hong bin

..............page:70-81

Reliability Test and Analysis of Heat-sink Product
jiang jing

..............page:436-443

The Development of Drilling Parameters Personalized Settings Software
guo xu ; li pin gao

..............page:161-164

Progress of Polymer Material for RFID Tag Inlays Packaging
guo zuo ; fan he ping

..............page:27-31

The Influencing Factors Of Hole Wall Roughness
yang hai yong

..............page:165-170

The Cause Analysis and Validation of Abnormal Crystal of Copper
lu li bin

..............page:201-207

The Research and Development of Multiple Printed Panel for PCB

..............page:557-562

Plasma Desmear Research of through Hole in Six-layer Rigid-flex Printed Circuit Board
zhou guo yun ; he wei ; wang shou xu ; he bo ; wang zuo ; mo zuo zuo

..............page:171-176

Advances in Electrical-optical Circuit Board and Its Applications
jin zuo

..............page:489-498

The Optical Waveguide Materials of Fluorinated Polyimides for EOPCB
chen wei ; fan he ping

..............page:478-488

Research of Undercut on Blind Hole by CO2 Laser Drilling
liu lan ; liu xiang long ; li zhi dong

..............page:147-151

yin zhi dian lu xin xi zheng gao qi shi

..............page:前插一

The Design and Manufacture Technology of Blind and buried Via PCB
liu dong

..............page:550-556

Application of New Type of Buffer Material in CCL Industry
liu xi

..............page:96-98

The Useful Application Projects in PCB AOI Inspection
wu ying xin

..............page:382-390

The Difficulty for Micro-Via Plating and Reliability Discussing
chen wen de ; chen chen

..............page:195-200

Solder Mask Process of Heavy Copper Printed Circuit Board
leng ke ; zhu xing hua ; zhang jun

..............page:290-293

Brief Report of Delamination During PCBA
ge chun

..............page:376-381

PCB Electrical Test Equipment Development Trend
hou yu

..............page:355-362

Discussing the Gold Pads Surface Whitening of ENIG PCB
yang wei feng

..............page:306-316

The Impact of Re-plating Copper on Product Reliability
huang bing meng ; zhu xing hua

..............page:192-194

Research on a New Electroless Copper Plating Solution for Thinner Copper Deposit
ou sheng ; liu bin yun ; zheng xue ming ; wang heng yi

..............page:186-191

The Different Configuration of Copper Foil Matte Side Impact on the Etching Property
li da guang ; wu xiao lian

..............page:44-50

The Progress of Halogen-free Flame Retardant Epoxy Resins and Curing Agents in Flexible Copper Clad Laminate
liu gang ; fan he ping

..............page:32-43

SWStudies on the Impact of Curing Degree upon Interphase Bonding Strength and Heat Shock Resistance
li yan guo ; ding he bin ; li zhi dong

..............page:99-104

Study on Registration Accuracy for HDI Boards
xia zhi ; tang pan ; yu zhan

..............page:55-64

The Future Technology of High Performance Heat Sink PCB Products
ye ying cai

..............page:20-26

The Dry Condition of Pre-treatment Impact on Dry Film
ma zuo

..............page:82-88

The Effect of Liquid Photo Resist Debris on Fine Lines
xu juan ; tian ling ; wang wei wen

..............page:65-69

What Brought to PCB Industry by the Coming of 3G Era
bai yong lan ; jin xia ; zou zuo

..............page:1-10

Research and Improvement of Copper Thickness about Different Fine Line Space on Copper Pattern Plating
tian ling ; wang wei wen ; li zhi dong

..............page:51-54

Test of Different Thickness of Gold and Nickel
lin xiao dan

..............page:411-417

HASL Lead-free Solder Hole Burst Analysis and Improvement
xu huan

..............page:239-248

Prepreg Properties Filling Study and Discussion
wang li feng

..............page:111-114

Testing of Attack by Different Microetch Amount on ENIG Board Dipped in the Au-bath for Different Time
zhang wei xuan ; luo zhuo sheng

..............page:249-255

Enhance the Drilling Efficiency
li xin ; gong lei ; tang pan ; zhang wen bo ; zhen wen yuan

..............page:127-133

Micro Drill Coated by Modified Physical Vapor Deposition(MPVD)
tong jiang hao ; lu zhen xiang ; chen ke zuo

..............page:122-126

Key Points to Develop Ultra Small Micro Drill Bit
fu lian yu ; wang jian ; luo chun feng

..............page:115-121

OrmeSTARTMULtra-The Organic Metal Nanofinish
Bernhard Wessling

..............page:256-268

PCB Vision Inspection System Based on Morphological Watershed Algorithms
mei ling liang ; liu lin

..............page:338-343

The Mechanism Study of Sn-0.7Cu Lead-free Solders Properties Modified by Ni、Ge Microelements
wang zuo

..............page:324-329

Improvement Study of Crinkle in Multilayer Printed Circuit Boards Pressing
xie zhong wen

..............page:105-110

Definition and Improvement for Plating Film Folder, Film un-striped and Etching Incompletion Issue
gu jian fu

..............page:208-212