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Printed Circuit Information
1009-0096
2009 Issue 9
Examination Results of Editorial Quality of Printed Circuit Information
Ma Ming-cheng
..............
page:3
Holding of Preparing Meeting for Special Equipment Sub-association of CPCA
GU Wei-jun
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page:4
Accelerate the Steps of Independent Innovation from Technique and Products-China PCB Industry Turns into Age of Independent Innovation(5)
LIN Jin-du
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page:5
Discussion on the Level of Articles and Dissertations(1)——The Difference between Science and Technology
LIN Jin-du
..............
page:8
Printed Electronics Review(3)
GONG Yong-Lin
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page:11
Important Problems in Laser Drilling for Printed Circuit Board Manufacturing
LIN Qi-shui
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page:15
Innerlayer Copper Reliability of Electroless Copper Processes
WANG Yi-ping
..............
page:19
Application of Laser Technology in PCB Industry
LEI Qun
..............
page:22
Research on Testing Method for Gold-Plating Porosity of PCB
ZHANG Xuan-dong;ZHAO Li;CHEN Guo-hui;ZHOU Guo-yun;MO Yun-qi;HE Bo;HE Wei
..............
page:27
Selection Methodology Study of Strain Gages for Printed Circuit Board Strain Measurement
SHI Hong-bin;WU Jing-chang;ZHANG Jing
..............
page:30
Study on Restriction Method for External Stress Whisker
CAI Ji-qing
..............
page:36
Optimize RTR(Roll to Roll)Producing Parameters for 25μm/25μm COF Fine Lines
LIU Zun-qi;ZHANG Sheng-tao;HE Wei;MO Yun-qi;ZHOU Guo-yun;NI Qian-feng;JIN Yi;HE Bo;CHEN Lang;WANG Song;LIN Jun-xiu
..............
page:41
Effects of PCB Vias on High-Speed Signal Transmission
ZHAO Lian-qing;LIU Er-li
..............
page:46
Manufacture and Control of Dissymmetry HDI PCB
LUO Jia
..............
page:48
Review on Regeneration Methods for Spent Alkaline Etchant
JIANG Yu-si;WANG Hong-hua
..............
page:51
Practice of Cleaner Production in Manufacturing Plants
SHAO Jian-guo
..............
page:54
Progress in Research of Flux Compositions
Gao Si
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page:59
Technical Development of High Performance Lead-Free Solder Pastes and Fluxes
CAI Ji-qing
..............
page:63
The Influence on PCBAs Interconnect Reliability with Lead-Free Processing
HU Zhi-yong
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page:67