Printed Circuit Information 2009 Issue 7 Development and Future of Lead-Free Technology

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Printed Circuit Information
1009-0096
2009 Issue 7

Development and Future of Lead-Free Technology
CAI Jiqing

..............page:18

Printed Electronics Review (1)
GONG YongLin

..............page:11

Grasp Basic Content of Independent, Innovation in Concepts and Knowledge——China PCB Industry Turns into Age of Independent Innovation(3)
LIN Jindu

..............page:8

Printed Circuit Industry Doesn't Belong to Plating Industry
WANG Longji

..............page:7

Congratulations to 100 Top Enterprises of China Printed Circuit Industry of 2008
GUAN Jianhua

..............page:5

Policy and Regulations(3)

..............page:3

Analysis of Status Quo and Selection of Strategies of Domestic Laminated Busbar Industry
HU Wenbo

..............page:24

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(Ⅶ)——Low CTE High Reliability Good Processability PCB Substrate Material R-1755V from Panasonic Electric Works
ZHANG Jialiang

..............page:26

Quality Control Points in Electrodeposited Copper Foil Production
FU Wenfeng

..............page:31

Studies in Manufacture of High Layer Counts Rigid-Flex PCB
ZENG Fangzi;TAN Yongzhong

..............page:33

Design of Planar Microstrip Antenna Substrate for Household Appliances
MA Jingfeng

..............page:36

Analysis of EMC for High Speed PCB
YI Li;LIN Ankun

..............page:38

Selection of Solder for Lead-Free HASL
LIN Jindu;ZENG Shu

..............page:41

Application of Digital Printing in Printed Circuit Board Manufacturing
QI Cheng

..............page:46

Practical Development of Buried Components Printed Circuit Boards
MA Mingcheng

..............page:51

Pushing on Object Cost Management, Maximizing Profit of Enterprises——How to Get Rid of Mire of Economic Crisis
LIN Sumin

..............page:55

Utilize CIMS Technique in PCB Assembly
XIAN Fei

..............page:59

Thermal Simulation for Thermal Design Optimization of PCBs
HU Zhiyong

..............page:62

Key Factors for Chips Placement Quality Control
ZHU Guibing

..............page:65

New Product & New Technology(31)
gong yong lin

..............page:70