Printed Circuit Information 2009 Issue 6 Environment Protection Control and the Hidden Rules

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Printed Circuit Information
1009-0096
2009 Issue 6

Environment Protection Control and the Hidden Rules
WANG Longji

..............page:3

New Product & New Technology(30)
gong yong lin

..............page:70

Developing Trend of Chip Package Technology
XIAN Fei

..............page:65

Application of FFU in Electronic Clean Room
Qin Jianjun

..............page:61

Brief Discussion on Selection of Clean Room Air-conditioning Modes for Electronic Factory
ZHONG Ronggui

..............page:58

Sand Bath Method and Choice of Thermal Stress Test Method for PCB and CCL
ZHANG Naihong

..............page:55

A Novel High Effectual Ionic Contamination Tester
LIU Shiqun

..............page:49

Micro-via Filling and Through Hole Plating in one Process in Vertical Line
XIONG Haiping

..............page:46

Development of Flexible Printed Circuit Board with Ball Bumps
SUN Yingying

..............page:42

Via Drilling Trial in Rigid-flex PCB with Acrylic Film and Its Mechanism
ZHOU Guoyun;HE Wei;WANG Shouxu;LIU Zunqi;WANG Song;MO Yuqi;CHEN Lang;HE Bo

..............page:38

Printable Electronic Technology
CAI Jiqing

..............page:31

Research and Development Trends of Nano Silver Conductive Ink for Ink-Jet Printing of PCB
JI LiNa;TANG XiaoFeng;YANG ZhenGuo

..............page:26

Technical Overview and Trends of Black Oxide Alternative Treatment Process
CAI Jiqing

..............page:21

Aluminum Plate Surface Preparation Process for Aluminum Core Copper Clad Laminate
QIAN Licheng;JIN Weiguo;WANG Long

..............page:19

EIPC Winter Conference Review
WANG Yiping

..............page:13

How to Raise Enterprise Core Competitiveness
TANG Changjiang

..............page:7

Begin from Theory and Cognition--China PCB Industry Turns into Age of Independent Innovation(2)
LIN Jindu

..............page:5

Conductive Pastes should not be Drafted as a National Standard for the Present
WANG Longji

..............page:4