Printed Circuit Information 2009 Issue 4 Treaty of Social Responsibility of China Printed Circuit Association

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Printed Circuit Information
1009-0096
2009 Issue 4

Treaty of Social Responsibility of China Printed Circuit Association

..............page:3

Development and Application of the Digital Inkjet Printing Technology
LIN Jin-du

..............page:5

New Technology Trend of High Density High Performance PCB
CAI Ji-qing

..............page:7

Development of New Epoxy Resin for PCB Base Materials
ZHU Da-tong

..............page:17

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(5)-Low Dk and High Tg Materials for Multi-layer PCBs:MEGTRON 4 from Matsushita Electric Works
ZHANG Jia-liang

..............page:22

The Dielectrics Characteristics of Base Materials for High Frequency Printed Circuit Boards and the Progress in Modification
YANG Meng-hui

..............page:27

Hydromechanical Analysis of Etching Process
TIAN Ling;LI Zhi-dong

..............page:32

Talking about PCB Etching Solution with(NH4)2S2O8 as Major Etchant
YE Bing-rui

..............page:34

Important Problems in Magnetic Ink Screen Printing for Certificate Cards
QI Cheng

..............page:38

Study on Stability of Eletroless Nickel Immersion Gold——Summary of study on Stability of Immersion Gold
XIAO Yun-shun

..............page:43

Copper Plating Process for Printed Circuit Board and Disposal of Common Problems
LIN Qi-shui

..............page:46

Copper Dissolution:A New Industry Challenge
WANG Yi-ping

..............page:67

Summarizing on Lead-free Soldering in Electronics Industry
XIAN Fei

..............page:63

Humanized Management and Strict Enterprise Ruling——Brief in Compatibility of Humanity and Principle in Enterprise Management
NIU Yu-fang

..............page:56

About the EMC Design of Printed Circuit Board
YAO Xin

..............page:53

1+1＞2,An Innovative Cooperation Approach for HDI Rigid-Flex Manufacturing
DING Ze-Fang;WU Yu

..............page:50