1009-0096
2009 Issue 11
Study on Application of Nitrogen-Containing Phenolic Resin in Halogen-Free Copper Clad Laminate
li jie ; wang bi wu ; he yue shan
li jie ; wang bi wu ; he yue shan
..............page:19-22,27
Printable Electronic Technology(2)
cai ji qing
cai ji qing
..............page:15-18,44
..............page:12-14
..............page:7-11
..............page:5-6
Calmness in Chorus of Recovery
you lei
you lei
..............page:3-4
Copper Conductive Patterns Direct Writing by Ink-Jet Printing
yang xiao jian ; he wei ; wang shou xu ; yang ying ; hu ke ; he bo ; mo zuo zuo
yang xiao jian ; he wei ; wang shou xu ; yang ying ; hu ke ; he bo ; mo zuo zuo
..............page:28-31,35
Effect and Improvement for Circuitry Openings and Nicks by Dry Film Sludge
liu yang ; zeng hong ; zeng zhi jun ; li qin yuan ; dai jie
liu yang ; zeng hong ; zeng zhi jun ; li qin yuan ; dai jie
..............page:23-27
..............page:71-72
..............page:57-60
Precise Controlling of Resistance and Characteristic Impedance of PCB
yuan huan xin ; su fan chun
yuan huan xin ; su fan chun
..............page:51-56
Discussion on Corrosion-Resistance of Gold Fingers
zhang tao ; qiao shu xiao
zhang tao ; qiao shu xiao
..............page:45-50
Analysis of Plasma Etchback Process Factors Interaction for PCB
ni qian feng ; yuan zheng xi ; mo zuo zuo ; he wei ; he bo ; chen lang ; wang zuo
ni qian feng ; yuan zheng xi ; mo zuo zuo ; he wei ; he bo ; chen lang ; wang zuo
..............page:41-44
..............page:37-40
Process for Painting Nameplate
shi wei zuo
shi wei zuo
..............page:36-36,56
..............page:32-35
..............page:70
..............page:65-69
..............page:61-64