Printed Circuit Information 2009 Issue 1 Policy and Regulations

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Printed Circuit Information
1009-0096
2009 Issue 1

Policy and Regulations

..............page:3

If Winter Comes,Can Spring be Far Behind?
WANG Long-ji

..............page:5

Review and Forecast of Surface Mounting and Related Industry in China
WANG Bo-hua

..............page:6

Report on the Influence of International Economic Crisis on Printed Circuit Industry
CPCA

..............page:9

The Year of Challenge, Adjustment and Opportunities New Year's Dedication
LIN Jin-du

..............page:11

Enjoy the Habit of Japanese of Dedicating Themselves to Their Work through Their Basic Skills in Details
HU Wen-bo

..............page:14

The Status and Challenge of PCB in China
LIN Jin-du

..............page:16

PEEK Film used in White Copper Clad Laminate for LED Chips——Review of Development About Special CCL (4)
ZHU Da-tong

..............page:20

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(2)——High Heat Resistance and Low Dielectric Loss PCB Material R-2125 of Matsushita Electric Works Compatible for Lead-Free Soldering
ZHANG Jia-liang

..............page:25

Lead-Free Process Compatible No-Flow Prepreg for Rigid-Flex PCB
NI Qian-feng;YUAN Zheng-xi;MO Yun-qi;HE Wei;HE Bo;CHEN Lang;WANG Song

..............page:32

Pay Close Attention to Lead-Free Design for Manufacturing
HU Zhi-yong

..............page:35

Cause Analysis and Improvement Action for PCB Open-Circuit Failure
DENG Hong-xi

..............page:39

Effect of ESD on Insulating Characteristic of PCB
TIAN Zhong-jun

..............page:44

Inhibition Methods for External Stress Type Whisker
CAI Ji-qing

..............page:46

The Research on UV Laser FPC Profiling Technology and its Equipment Manufacturing
MEI Ling-liang;QIN Xian-de;DUAN Jun;ZHANG Fei

..............page:51

Effect after Clean Production in PCB Industry (1)
ZHANG Le

..............page:55

Effect after Clean Production in PCB Industry (2)
ZHANG Le

..............page:58

Summary of New Soldering Technology for SMT/THT Mixed Production
XIAN Fei

..............page:60

Present Situation and Future Development of Low Temperature Lead-free Solder Mounting
CAI Ji-qing

..............page:65

tui dong zi zhu chuang xin zou zuo da zuo qiang zhi lu cpca can jia di ba jie xin xi chan ye zhong da ji shu fa ming ping xuan jie guo fa bu hui
yan yong hong

..............page:8