1009-0096
2008 Issue 7
Study on the Reactivity between Epoxy Novolac Varnish System and Polar Solvent
LI Xue;CHEN Cheng;XIAO Sheng-gao
LI Xue;CHEN Cheng;XIAO Sheng-gao
..............page:22-24
..............page:14-18
..............page:6-8
Case Analysis and Control Countermeasure for CAF Growth in PCB
NIE Xin;WANG Yang;MO Yun-qi;HE Wei
NIE Xin;WANG Yang;MO Yun-qi;HE Wei
..............page:45-47
..............page:29-33
..............page:70
..............page:36-37
Failure Analysis for Electronic Devices
LV Jun-xia
LV Jun-xia
..............page:52-55
..............page:58-60
The reliability of All Polyimide Multilayer Wiring Board
Takaharu Hondo;ZHANGgLiang-jing;ZENG Shu
Takaharu Hondo;ZHANGgLiang-jing;ZENG Shu
..............page:48-51
CS-38,A New Immersion Silver Plating Process Over Copper for PCB
LI Xiao-qiong;ZHOU Hai-ping;ZHANG Zheng;WANG Ke-jun
LI Xiao-qiong;ZHOU Hai-ping;ZHANG Zheng;WANG Ke-jun
..............page:34-35,47
The Time of RFID is Racing to Us
LI Chun-fu
LI Chun-fu
..............page:19-21,40
Study on Folding Endurance of Three-layer Flexible Copper Clad Laminate
WU Hong-kui;YANG Hong
WU Hong-kui;YANG Hong
..............page:25-28,51
..............page:71-72
Optimization of PCB Drill Bits Life Based on Reliability Analysis
CHEN Hai-bin;FU Lian-yu;ZOU Wei-xian
CHEN Hai-bin;FU Lian-yu;ZOU Wei-xian
..............page:41-44
..............page:9-13
Both Standardization, Environment Protection is Essential to China Electronic Circuits Industry During Style Transferring
GUAN Jian-hua;WANG Long-ji
GUAN Jian-hua;WANG Long-ji
..............page:3-5
Studies on the Recycling Economy of PCB Industry
DONG Kun;WU Gan-hong
DONG Kun;WU Gan-hong
..............page:56-57
Failure Analysis on BGA Solder Joints
WANG Yang;MO Yun-qi;HE Wei;LIN Jun-xiu;XU Yu-shan;WAN Yong-dong
WANG Yang;MO Yun-qi;HE Wei;LIN Jun-xiu;XU Yu-shan;WAN Yong-dong
..............page:61-64
Preliminary Discussion on Production of High-Tg PCB
JIAO Xiao-yan
JIAO Xiao-yan
..............page:38-40
..............page:65-69