Printed Circuit Information 2008 Issue 12 New Product & New Technology(24)

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Printed Circuit Information
1009-0096
2008 Issue 12

New Product & New Technology(24)
gong yong lin

..............page:70

Problems to be Noticed in Conductive-ink Silk Screen Printing
QI Cheng

..............page:65

Materials for Next Generation Semiconductor Packaging
CAI Jiqing

..............page:59

Silk Screen Printing Technique of Solder Paste in Surface Mounting Technology
QI Cheng

..............page:55

Processing Technology of High Thermal Conductive Aluminum Substrate
WANG Youlin

..............page:52

LTCC-MLB Using Jet-ink and Thin-film Circuit Technology
MA Mingcheng

..............page:48

New Trend of Component Embedded PCB Technology
CAI Jiqing

..............page:44

Effect of Coverlay on Conforming Capability of FPC
WANG Kefeng

..............page:42

The Research Progress of Nickel-stripper for PCB Industry
ZHU Mingjie;YANG Zhenxing

..............page:39

Discussion on and Practice of the Requirements of Thick Copper Electroplating for Thick Board
XIAO Yunshun

..............page:34

The High-frequency Materials for Lead-free Soldering
LIN Jindu

..............page:29

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(1)——Low CTE Environmental Friendly Material MCL-E-679GT of Hitachi Chemical for Thin Package Substrates (B)
ZHANG Jialiang

..............page:25

New Technology Trend of Printed Circuit Board
CAI Jiqing

..............page:17

Current Situation of Global PCB Industry
YANG Hongqiang

..............page:9

Waiting for Feasible Standards
LIN Jindu

..............page:6

So Many Regulations were Yielded to the Interest of Administrative Departments
WANG Longji

..............page:5

Policy Must be Stabilized, Fine Adjustment Must be done on Time
WANG Longji

..............page:3