Printed Circuit Information 2008 Issue 11 Evolution and Current Status of Lead-free Solder Plating

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Printed Circuit Information
1009-0096
2008 Issue 11

Evolution and Current Status of Lead-free Solder Plating
CAI Ji-qing

..............page:66

Methods to Export X-Y Data from PCB Design System
XIAN Fei

..............page:60

Evaluation Method of Flexural Endurance of Flexible Copper Clad Laminate
WU Hong-kui;YANG Hong

..............page:56

Technical Analysis for Development of High Frequency & Microwave Printed Circuit Boards
HUANG Sheng-rong

..............page:51

Challenge of 3G Mobile to PCB Industry
TANG Yan-ling

..............page:48

The Present and Future of Organic Solderability Preservative
LIN Jin-du

..............page:44

Brief Description of Via Fill-plating
ZHAI Shuo

..............page:41

Key Technique in Silk Screen Printing for Inorganic Semi-conductor Solar Cells
QI Cheng

..............page:36

Low Thermal Expansion, High Elastic Modulus Glass Fabric Epoxy Copper-clad Laminate
CAI Ji-qing

..............page:29

Progress in Application of Liquid Crystal Polymer for FCCL
LIU Sheng-peng;RU Jing-hong;LIANG Li

..............page:26

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(1)——Low CTE Environmental Friendly Material MCL-E-679GT of Hitachi Chemical for Thin Package Substrates (A)
ZHANG Jia-liang

..............page:22

PCBs going toward Higher Density and Higher Fineness
MA Ming-cheng

..............page:16

Prospect of Electronic Manufacturing Industry is Declining while Constitutive Development Opportunity is Appearing
QU Wei-ping

..............page:9

About Enterprise Competition & Social Responsibility
JIANG Kai-rong

..............page:7

Environment Protection Takes Priority-No Transferring to the Pollution
LIN Jin-du

..............page:4

Environment Protection is not just Raising the Standard
WANG Long-ji

..............page:3