1009-0096
2007 Issue 9
shan deng jue ding wo wei feng
wang long ji
wang long ji
..............page:插2
qing bu yao wang zi fei bao
wang long ji
wang long ji
..............page:插1
..............page:71-72
New Product & New Technology
gong yong lin
gong yong lin
..............page:69-70
..............page:64-68
..............page:59-63
..............page:55-58
Fabrication and application of HDI-LineCard
You Lei;Yang Zhiqin;Kong Lingwen
You Lei;Yang Zhiqin;Kong Lingwen
..............page:51-54
A Simulation Software for Predicting Thermal Performance of Embedded Components
Cui Hao;He Wei;Zhou Guoyun;He Bo;Zhang Xuandong;Xu Jinghao;Guan Jian
Cui Hao;He Wei;Zhou Guoyun;He Bo;Zhang Xuandong;Xu Jinghao;Guan Jian
..............page:45-50,70
..............page:42-44
..............page:37-41
Analysis of Approaches for Reducing Crosstalk between Coupled Microstrip Lines
Fang Zhijian;Jiang Yufeng;Wang Li
Fang Zhijian;Jiang Yufeng;Wang Li
..............page:34-36
Research of Via in High-speed PCB Design
Wei Lili;Liu Hao
Wei Lili;Liu Hao
..............page:31-33,41
A Software for Cutting Prototype Costs
Hu Zhiyong
Hu Zhiyong
..............page:27-30
Essentials of Multilayer PCB Designing
Liu Weixiong
Liu Weixiong
..............page:24-26
The Innovation and Advancement of PCB Process
Ding Zhilian
Ding Zhilian
..............page:19-23
..............page:13-18
..............page:9-12,30
Development of FCCL Technology
Gu Xinshi
Gu Xinshi
..............page:7-8,23
..............page:4-6,63
Combining with Common Interest
Liu Shufeng
Liu Shufeng
..............page:3