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Printed Circuit Information
1009-0096
2007 Issue 6
yin zhi dian lu xin xi tou gao xu zhi
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page:中插页1
Literatures & Abstracts(70)
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page:71-72
New Product & New Technology(60)
gong yong lin
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page:70
Causes and Control of Popcorn in PCB Lead-Free Soldering
Ma Xuehui
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page:64-69
An Example of Application Techniques of CAD/CAM Software in Electronics Assembling
Xian Fei
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page:59-63
Debug Method and Technique for Electronics Equipment Circuits
Lv Junxia;Li Weiheng
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page:55-58
Another Cut-in Point to PCB Industry——TS16949 Standard
Lin Yuntang
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page:51-54
Substrate with Combined Embedded Capacitance and Resistance for Better Electrical Performance and Higher Integration
He Bo;Zhou Guoyun;He Wei;Cui Hao;Zhang Xuandong;Xu Jinghao
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page:47-50
Study on Processing Technology of Step Designed Planar Buried Resistor PTFE Multilayer Printed Circuit Board
Yang Weisheng
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page:40-46
Through Hole Filling Technology by Copper Electroplating for SiP
Ding Zhilian
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page:36-39
SiP/PoP Build-Up Board
Cai Jiqing
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page:32-35
Cause Analysis and Correction of Treeing in Gold Plating on PTEE Board
Zhao Wei
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page:30-31,63
Research in Flux for Lead-Free HASL
Li Weihao;Lu Yun;Cai Hanhua
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page:28-29
Manufacture Technology of Antenna for RFID
Tang Baoling
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page:24-27
Newly Trend of PCB Digital Imaging
Cai Jiqing
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page:19-23
Development of Copper Roughening Agent
Li Weihao;Lu Yun;Cai Hanhua
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page:17-18,46
Flip Chip Technology and Its Development
Gao Feng
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page:14-16,27
Materials(Ⅴ)——Innovation in Application Techniques of Fillers in Resin Composition of FR-4 Copper Clad Laminates
Zhu Datong
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page:7-13
Government Officers' Misconducting Compromises Industry and Enterprises——Talking about Implementation of PCB Production License System
Lin Jindu
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page:4-6
Create International Electronic Industry Expo
Wang Longji
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page:3,13