Printed Circuit Information 2007 Issue 10 The Visitation with India

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Printed Circuit Information
1009-0096
2007 Issue 10

The Visitation with India
Wang Longji

..............page:3-4

Spread the Application of 'Zero' Discharge of Copper Etchant
Lin Jindu

..............page:5-6,17

PCBs for Flat Displays and IC Packaging Substrates Attract Attention
Zhang Ping

..............page:7-7,28

Review of Innovation to Technology and Equipment for Impregnation of Prepreg in Japan(2)
Zhu Datong

..............page:8-12,53

The Technology Trends and the Demand Predication of FPC Materials
Cai Jiqing

..............page:13-17

Designing for High Performance Multilayer PCBs
Hu Zhiyong

..............page:18-21

PCB-Level Twisted Differential Interconnecting Structure for Reducing Inductive and Capacitive Crosstalk Noise
Jing Wei

..............page:22-25

Discussion on the Infrared Safety Protection Set Circuits
Lv Junxia

..............page:26-28

Achieve Low-Cost and Mass Production in HDI/BUM with New LDI
Lin Jindu

..............page:29-32

Development of Super Thin Multilayer Board with Ink Jet Technology
Cai Jiqing

..............page:33-35,69

Main Points and Troubleshooting of Common Problems in Phototool Preparation for Printed Circuit Boards
Lin Qishui

..............page:36-38

Study on Processing Technology of DiClad880 Microwave Multilayer Printed Circuit Boards
Yang Weisheng;Xi Yang;Yang Jinzhuo

..............page:39-46

New Final Finishing for IC Packages Substrates-Electroless Nickel/Electroless Palladium/Immersion Gold
Gong Yonglin

..............page:47-49

About Interactions Among Engineering, Production and Quality Departments
Tan Wen

..............page:50-53

Water Saving Technology in Electrodeposited Copper Foil Production
Liu Jianhua;Song Jizhi

..............page:54-56

Discussing the Treatment of Phenolic Waste Water
Liu Jianhua;Niu Zhenxiang

..............page:57-59

Measuring Medal Ions Contain of Industrial Waster Water in the PCB Plant——EDTA Method
Yang Hesheng

..............page:60-63

The Measurement of pH Value of Waste Water from PCB Industries pH Electrode Method
Yang Hecun

..............page:64-66

3D AOI Replies the New Challenge in Solder Paste Printing
Xian Fei

..............page:67-69

New Product & New Technology
Gong Yonglin

..............page:70

Literatures & Abstracts(74)

..............page:71-72

tou gao xu zhi

..............page:插1-插2