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Printed Circuit Information
1009-0096
2005 Issue 9
yin zhi dian lu xin xi tou gao xu zhi
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page:73
Literatures and Abstracts (49)
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page:71-72
Circumvent
Su Wen er
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page:69-70
The Research of Lead-free Solder - Physics Properties and Interfacial Reaction
Yang Bangchao;Ren Hui;Su Hong
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page:63-68
The Summarizing for SMT Testing Technology
Xian Fei
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page:60-62
Reliability Evaluation and Analysis Technology of Pb-free Solder Mounting Components
Cai Jiqing
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page:55-59
Flexible Placement Equipment Facing to the 21th Century
Xian Fei
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page:53-54
Application of Supplier Information Management Systerm in PCB Companies
Huang Shaomin
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page:51-52
The Analysis of MLB Bow and Twist
Chen Cheng
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page:49-50,72
Application of Laser-measurement in PCB Industry
Luo Weike
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page:47-48
The Influence of MCPCB's Frame to LED
Guan Chun;He Feng
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page:45-46
Production Feasibility Design of High Frequency Microwave PCB
Liang Liping
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page:43-44
High Density Glass Substrate Having Copper Filled Via-hole
Cai Jiqing
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page:37-42,48
Exploration of Influence Factors of Via-filling Plating Process
Zeng Shu;Zhang Boxing
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page:33-36
The Root Cause of Copper Scale and How to Deal With It
Li Zhiyong
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page:31-32
The Structure and Performance of Cyanate Ester Resin
Lou Baoxing
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page:27-30
The Status of The Production and The Market Development of Electronic in and out
Ou Huisheng
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page:23-26
The Discussion of Characteristic about FR-4 Type Copper Clad Laminate for Adaptation to Lead-free Assembly(2)
Zhu Datong
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page:18-22,36
Comprehension of Lead-free and Correlative Consideration for PCB
Chen Hanzhen
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page:13-17
The Progress of Research in PCB Substrate from Proceedings of ECWC10 (2)
Zhang Jialiang
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page:9-12
Innovating Continuously Exploiting Market Serving Customer
Yu Chunze;Hu Ailin
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page:7-8,32
Taking Part in PCB Industry Proseminar
WEI Liangcai
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page:6,44
Never Forget Historical Lessons Undeveloped Country Has No Say
Wang Longji
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page:5,26
The Situation Anallysis of China Electronic Information on One First Half Year
CPCA
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page:4,17
The Implemental Lead-free Setup is A System Engineering in Electronic Products
Lin Jindu
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page:3,46