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Printed Circuit Information
1009-0096
2004 Issue 11
Literatures and Abstracts(41)
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page:71-72
Reduce the Stafftrimmer
su wen er
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page:69-70
Auisotropic Conductive Film
cai ji qing
..............
page:64-68
The Development of CPU Chip Package Technology
xian fei
..............
page:61-63
The Systematic Way to the Work Field Cost Management of PCB's Manufacturing
liu yu dong
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page:58-60
The Test Technique of Characteristic Impedance in PCB
qin geng ; zuo ning biao ; li xiao ming
..............
page:55-57
Reason and Solution of Deformation of Material in Multilayer Flexible Circuits
he wei ; wu zhi qiang ; qiao san long
..............
page:52-54
An Advanced Coating Process for the Surface Planarization of PCB
zhang bo xing
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page:48-51
Talking about the Problems Related to Chemical Immersion Ni/Au
fang sheng ze
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page:45-47
Obviously Talking about the Problems Related to High Phosphor Content Nickel and Immersion Gold
fang sheng ze ; zhou wen hui
..............
page:41-44
Manufacturing Process of Buried/Blind Via for 4-layer Board
wei li bo
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page:39-40
Cause of Multilayer Printed Board's Warp and the Countermeasure
wu dong po ; xue xiao wei
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page:37-38,47
Wet Lamination on Fine Line Manufacturing
deng wen ; yang tian zhi ; li xue yi ; zhang rui zhen
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page:35-36
The Application of Organo-metallic Process in Enhancing the Bonding Strength
wang a hong
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page:30-34
Study of Fine Circuit Manufacturing Technology on HDI
chen yi hua
..............
page:25-29
PWB Technology Roadmap
cai ji qing
..............
page:19-24
Korea's PCB Industry (1)
steve gold;bob neves; yang hong qiang ; wang hong
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page:15-18,44
The Retrospect of a Century of Development of PCB Used Base Material
zhu da tong
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page:7-14
chuang zao shi jie ming pai -- fang jin zhou huang wei zong jing li
wang long ji
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page:5-6
he jin zhou ke ji yuan
wang long ji
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page:4
Product Quality Depend on the Equipment, Process and Operation of PCB
lin jin du
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page:3,34