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New Technology & New Process
1003-5311
2005 Issue 2
BITCAPP System Integration Based on PDM
zhang heng wen ; zhang min ; cai ying ; ding xia qing
..............page:9-12
The MPI Communication between LabWindows/CVI and SIMATIC S7-300 PLC
li tian zuo ; li zhi ning ; wang li ; wang ke zheng ; du dong
..............page:12-14
The Computer Aided Process Planning for Flashless Die Forging of Gear Blanks
zuo hua min ; wang ze ; liu xiao yuan ; chi cheng zhong
..............page:15-17
Analysis of Blade Surface Parameters Based on UG Environment
su gao feng ; zhang qiu ju
..............page:20-21
Application of Java Technology in Internet-based Casting CAE System
ren yu fu ; jing tao
..............page:22-24
Nano Electro-brush Plating--The One Kind of Remanufacturing Key Technology
liu xiang ping ; xiang yong hua ; yao ju kun
..............page:25-26
The Design and Fabrication Process of a Novel Electro-magnetically Actuated Micropump
su yu feng ; chen wen yuan ; cui feng
..............page:27-29
Preparation and Mechanics Properties of FeSiB Amorphous Alloy′s Strip
song zuo ; zhu zheng hou
..............page:47-48
Progresses in Fabrication of SPM Probe
wang hong xia ; fu hui nan ; qu zhong rong
..............page:49-51
Application of Composite Thin Films Coatings in Valve Coordinating Surface Treatment Technologies
wan yu jie ; tong xing sheng ; xiong shun yuan
..............page:52-53
Research of Strengthening and Toughening Technology for HSS Cutters
zhang qun li ; chen ; yao jian hua
..............page:56-58
Research on Nanometer TiO2 Composite Electroless Plating
li xiao jun ; liu xiao lan ; wang lin ; liu su xiang ; wang xiao li
..............page:59-60
Experiment for Metal Burned by Eddy Current Testing
zhou zhi ping ; chen yong ; zhan jian ping
..............page:32-33
The Influenced Factors and Optimal Technology Parameters of Plasma Surface Quenching
wen zong zuo ; feng shu qiang ; li bao ling ; pang xin wei
..............page:38-39
ye jie dong tai
..............page:62-63
qi ye feng cai
..............page:64