New Developments of the Typical MEMS and Wearable Sensor Technologies(Continued)
Zhao Zhengping;China Electronics Technology Group Corporation;Science and Technology on ASIC Laboratory;

..............page:69-74

An Improved Field Limiting Ring Junction Termination Structure for High-Voltage 4H-SiC Diodes
Zha Yiying;Tian Liang;Yang Fei;State Grid Smart Grid Research Institute;

..............page:75-79

Research on the Injection Region Structure of the THz QCL
Wang Jian;Niu Chenliang;Wang Jianfeng;Shi Juliang;Han Ying;Xia Yingjie;Sun Baorui;The 13th Research Institute;CETC;

..............page:80-84+97

Research on Micro Hemispherical Hole Arrays of the Enhanced AntiReflection in Thin Film Solar Cells
Li Xinpeng;Wang Qingkang;Li Haihua;National Key Laboratory of Micro/Nano Fabrication Technology;Shanghai Jiao Tong University;Key Laboratory for Thin Film and Micro-Fabrication Technology of Ministry of Education;School of Electronics Information and Electrical Engineering;Shanghai Jiao Tong University;

..............page:85-88

Uniformity Research of Polypyrrole Composite Functional Films Based on Silicon Microstructures
Zhu Ping;Cai Ting;Ren Zhong;Xiong Jijun;Science and Technology on Electronic Test and Measurement Laboratory;North University of China;Key Laboratory of Instrumentation Science and Dynamic Measurement of Ministry of Education;North University of China;

..............page:89-92+122

Effects of the Annealing Temperature on the Crystalization and Refraction Index of the ZnO Thin Film
Pang Tianqi;Deng Jinxiang;Wang Jiyou;Chen Liang;Cheng Yi;Wang Chong;College of Applied Sciences;Beijing University of Technology;

..............page:93-97

In Situ Study on the Initial Growth of Er₂O₃ Films on Si Substrates by RHEED and AES
Yuan Junjun;Qiu Qinglin;Zhu Yanyan;College of Energy and Mechanical Engineering;Shanghai University of Electric Power;College of Mathematics and Physis;Shanghai University of Electric Power;

..............page:98-102

MEMS Vibration Energy Harvester Based on the Piezoelectric and Magnetoelectric Effect
Yang Jie;Xu Zhuo;An Kun;Chen Xiaoyong;Chou Xiujian;Science and Technology on Electric Test and Measurement Laboratory;North University of China;Key Laboratory of Instrumentation Science and Dynamic Measurement of Ministry of Education;North University of China;

..............page:103-107

Fast Frequency Characteristic Testing Method for the Low Damping MEMS Accelerometer Sensor
Zhang Xuhui;Xu Aidong;Bian Yumin;The 13th Research Institute;CETC;

..............page:108-112

Advances and Challenges of Metal Materials Prepared by Atomic Layer Deposition
Zhu Lin;Li Aidong;National Laboratory of Solid State Microstructures;College of Engineering and Applied Sciences;Nanjing University;

..............page:113-122

Ultrasonic Weldingof Diamond Particles on Si Surface with the Field Emission
Liu Chang;Su Yanjie;Wang Nan;Zhao Bo;Liu Xuan;Zhang Yafei;School of Electronics Information and Electrical Engineering;Shanghai Jiao Tong University;School of Physics and Electronic Engineering;Jiangsu Normal University;College of Engineering Science and Technology;Shanghai Ocean University;

..............page:123-128

Effects of the Polishing Pressure on the Polishing Performance of Nano-Sized PS/CeO₂ Composite Abrasives
Wang Yayun;Chen Yang;Zhao Xiaobing;Qin Jiawei;School of Materials Science and Engineering;Changzhou University;

..............page:129-134

zhong guo dian ke shi san suo dang xuan zhong guo ban dao ti xing ye xie hui mems fen hui li shi chang dan wei

..............page:135

wei guang ke ling yu de biao zhun hua ji xue shu jiao liu

..............page:136