New Developments of the Typical MEMS and Wearable Sensor Technologies
Zhao Zhengping;China Electronics Technology Group Corporation;Science and Technology on ASIC Laboratory;

..............page:1-13

Chaotic Dynamical Analysis of Josephson-Circuit-Coupled Quantum Cellular Neural Network
Wang Sen;Cai Li;Zhang Bin;Yang Xiaokuo;Feng Chaowen;The Science Institute;Air Force Engineering University;

..............page:14-19+30

Application of S/TiO₂ Nanocomposite in the Lithium-Sulphur Battery
Hu Changchen;Wei Liangming;Li Xiaolin;Lu Dejiong;Key Laboratory for Thin Film and Microfabrication of Ministry of Education;School of Electronic Information and Electrical Engineering;Shanghai Jiao Tong University;

..............page:20-24+36

Synthesis and Optical Properties of the PbS QD-MWCNT Heterostructure Material
Lu Dejiong;Li Xiaolin;Hu Nantao;Shen Yong;Wei Liangming;Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education;School of Electronic Information and Electrical Engineering;Shanghai Jiao Tong University;

..............page:25-30

Effects of Doped ZnO Thick Films on Acetone Gas Sensing Properties
Bai Weiqin;Pan Guofeng;Liu Mengmeng;Tian Ye;School of Information Engineering;Hebei University of Technology;Semiconductor Manufacturing International Corporation;

..............page:31-36

Defect Feature on the Band Gap of the One-Dimensional Photonic Crystal with the Single Center-Doped Defect Layer
Cai Yungao;Fang Xing;Dong Yinghong;Faculty of Science and Technology;Baoshan University;

..............page:37-41+68

Error Analysis and Test on the Secondary Integration of the MEMS Bionic Vector Hydrophone
Liu Yuan;Wang Lijuan;Zhao Peng;Shen Hui;Zhao Long;Zhang Guojun;Key Laboratory of Instrumentation Science & Dynamic Measurement of Ministry of Education;North University of China;Science and Technology on Electronic Test & Measurement Laboratory;North University of China;

..............page:42-48

A Bi-Stable Electromagnetic MEMS Switch
Li Huijuan;Sun Jian;Yang Zijian;Hao Changling;Yu Jifang;Beijing Aerospace Micromechanical Electronics Technology Institute;

..............page:49-53

Rapid and Uniform Etching of SiC Materials by NLD
Zhang Wei;Sun Yuanping;Liu Bin;Institute of Opto-Electronic Information Science and Technology;Yantai University;Suzhou Institute of Nano-Tech and Nano-Bionics;Chinese Academy of Sciences;

..............page:54-58+63

ICP-RIE Dry Etching of 4H-SiC Materials in SF₆/O₂/HBr
Wang Jinze;Yang Xiang;Niu Yingxi;Yang Fei;He Zhi;Liu Shengbei;Yan Wei;Liu Min;Wang Xiaodong;Yang Fuhua;Research Center of Semiconductor Integration Technology;Institute of Semiconductors;Chinese Academy of Science;SiC Power Device Center;Electrical Engineering New Mat and Microelectrical Department;State Grid Smart Grid Research Institute;

..............page:59-63

A Cleaning Agent for Effectively Removing CuO Particles on the Copper Surface After the CMP
Yang Zhixin;Gao Baohong;Wang Chenwei;Sun Ming;Sun Mingbin;Zhang Nannan;Cheng Chuan;Tan Baimei;Institute of Microelectronics;Hebei University of Technology;

..............page:64-68