1671-4776
2014 Issue 2
Switching Characteristics of the QCA Fanout Structure Based on the Bayesian Model
Chen Xiangye;Cai Li;Wang Sen;Cui Huanqing;Wang Zhichun;College of Science;Air Force Engineering University;
Chen Xiangye;Cai Li;Wang Sen;Cui Huanqing;Wang Zhichun;College of Science;Air Force Engineering University;
..............page:73-77
Application Progress of the Nanotechnology in Solar Cells
Shen Huijuan;Weng Zhankun;Yu Xiaogang;Jia Xiuli;Luo Minghui;Department of Basic Courses;Minnan University of Science and Technology;International Research Centre for Nano Handling and Manufacturing;Changchun University of Science and Technology;
Shen Huijuan;Weng Zhankun;Yu Xiaogang;Jia Xiuli;Luo Minghui;Department of Basic Courses;Minnan University of Science and Technology;International Research Centre for Nano Handling and Manufacturing;Changchun University of Science and Technology;
..............page:78-82+119
Preparation of the CuO-Doped TiO2 Thick Film by Sol-Gel Method and Its Gas Sensing Properties
Zhang Bingqiang;Pan Guofeng;Zhang Peishuo;Guo Qian;Institute of Microelectronics;Hebei University of Technology;
Zhang Bingqiang;Pan Guofeng;Zhang Peishuo;Guo Qian;Institute of Microelectronics;Hebei University of Technology;
..............page:83-88+104
Analysis of Gas Sensing Properties of the Nano Porous Silicon for MEMS Packaging
Xu Gaobin;Yang Yeshan;Ma Yuanming;Chen Xing;Micro Electromechanical System Reaserch Center of Engineering and Technology of Anhui Province;School of Electronic Science & Applied Physics;Hefei University of Technology;
Xu Gaobin;Yang Yeshan;Ma Yuanming;Chen Xing;Micro Electromechanical System Reaserch Center of Engineering and Technology of Anhui Province;School of Electronic Science & Applied Physics;Hefei University of Technology;
..............page:89-93
Electronic Structure Calculations on the Single Mo and Mo/S Codoped Anatase TiO2
Zheng Shukai;Li Wenming;Yan Xiaobing;Li Yanbo;College of Electronic & Informational Engineering;Hebei University;Research Center for Computational Materials & Device Simulations;Hebei University;
Zheng Shukai;Li Wenming;Yan Xiaobing;Li Yanbo;College of Electronic & Informational Engineering;Hebei University;Research Center for Computational Materials & Device Simulations;Hebei University;
..............page:94-98
Electrostatic Sucking Wafer Fabricated by the Micromachining Process and Its Tangential Attractive Force
Zhang Duanqin;Chu Jinkui;Liu Jianxiu;College of Mechanical and Electrical Engineering;Zhengzhou University of Light Industry;School of Mechanical Engineering;Dalian University of Technology;
Zhang Duanqin;Chu Jinkui;Liu Jianxiu;College of Mechanical and Electrical Engineering;Zhengzhou University of Light Industry;School of Mechanical Engineering;Dalian University of Technology;
..............page:99-104
AC Impedance Aptasensors for the Determination of the Adenosine Triphosphate
Yan Yanxia;Jiang Liying;Wang Fenfen;Hu Jie;Yue Baolei;College of Electric and Information Engineering;Zhengzhou University of Light Industry;
Yan Yanxia;Jiang Liying;Wang Fenfen;Hu Jie;Yue Baolei;College of Electric and Information Engineering;Zhengzhou University of Light Industry;
..............page:105-109+114
MEMS Vibration Micro-Power Devices Based on the Piezoelectric Effect
Chen Tingting;Guan Xinfeng;Yang Jie;Guo Tao;Chou Xiujian;Key Laboratory of Instrumentation Science & Dynamic Measurement of Ministry of Education;North University of China;Satellite Operations Division;Space Star Technology Co.;Ltd.;
Chen Tingting;Guan Xinfeng;Yang Jie;Guo Tao;Chou Xiujian;Key Laboratory of Instrumentation Science & Dynamic Measurement of Ministry of Education;North University of China;Satellite Operations Division;Space Star Technology Co.;Ltd.;
..............page:110-114
A Novel Surface Acoustic Wave Humidity Sensor
Tong Xiaojun;Wang Xinyu;School of Electronic Information and Electric Engineering;Changzhou Institute of Technology;State Key Laboratory of Modem Acoustics;Institute of Acoustics;Nanjing University;
Tong Xiaojun;Wang Xinyu;School of Electronic Information and Electric Engineering;Changzhou Institute of Technology;State Key Laboratory of Modem Acoustics;Institute of Acoustics;Nanjing University;
..............page:115-119
Effects of Different Abrasives on the Sapphire CMP
Zhao Yunhe;Tan Baimei;Niu Xinhuan;Zhen Jiali;Guo Qian;Institute of Microeletronics;Hebei University of Technology;
Zhao Yunhe;Tan Baimei;Niu Xinhuan;Zhen Jiali;Guo Qian;Institute of Microeletronics;Hebei University of Technology;
..............page:120-125
Preparation Technology of Nano Ceramic Particles Reinforced Metal Matrix Composite Materials
Zhang Yang;Zhu Hao;Cao Yabin;College of Materials Science and Engineering;Shijiazhuang Tiedao University;
Zhang Yang;Zhu Hao;Cao Yabin;College of Materials Science and Engineering;Shijiazhuang Tiedao University;
..............page:126-130+135
Application of the Au/Sn Eutectic Bonding Technology in the Packaging of MEMS
Xu Chao;Xu Yongqing;Yang Yongjun;Yang Zhi;The 13th Research Institute;CETC;Science and Technology on ASIC Laboratory;
Xu Chao;Xu Yongqing;Yang Yongjun;Yang Zhi;The 13th Research Institute;CETC;Science and Technology on ASIC Laboratory;
..............page:131-135
chan pin
wang ling ;
wang ling ;
..............page:136-138
ji shu
wang ling ;
wang ling ;
..............page:136
shi chang
wang ling ;
wang ling ;
..............page:138
..............page:139-140
..............page:140