Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Micronanoelectronic Technology
1671-4776
2012 Issue 5
Structure Design and Simulation of the MEMS Gyroscope Based on Leverage Mechanism
Li Xiaoqing;Chang Honglong;Jiao Wenlong;Xie Jianbing;Yuan Guangmin
..............page:313-317
Noise Depression for the Parallel Capacitive of MEMS Resonators
Tang Meng;Feng Ming;Cheng XinHong
..............page:318-322
Research on the Polyimide Micro-Etching Process
Dong Shuancheng;Yuan Weizheng;Ma Binghe;Deng Jinjun;Hao Ripeng
..............page:323-327
Development Status and Key Technologies of the Hybrid Insect MEMS
Feng Qingjuan;Hu Kaibo;Zhu Zhiyuan
..............page:285-290,301
Latest Experimental Research Progress on Organic Field-Effect Transistors
Xie Jipeng;Ma Chaozhu;Yang Ting;Yao Bo;Peng Yingquan
..............page:291-301
Study of the Dielectrostriction Coefficient of Thermal SiO2 Subjected to the Uniaxial Stress
Dong Weijie;Chen Xiaowei;Cui Yan;Huang Jianqiu
..............page:302-305,312
Performance of Solar Cells Containing Dye-Sensitized TiO2 Single-Crystal Nanorod Arrays
Wang Bo;Gu Xiuquan
..............page:306-312
Application of the Spacer Technology in the PCRAM
Fu Yingchun;Wang Xiaofeng;Zhang Jiayong;Xu Xiaona;Ma Huili;Ji An;Yang Fuhua
..............page:328-335
Nanosecond Laser Electrochemical Compound Masking Microfabrication
Wang Yaomin;Zhang Zhaoyang;Li Zhongyang;Mao Weiping
..............page:336-339,349
Effect of Back Pressure on the Uniformity of Wafer Thickness in the Cu CMP Process
Chuan Liwei;Liu Yuling;Wang Chenwei
..............page:340-344
Application of Wafer-Level Vacuum Packaging Technology for MEMS Gyroscopes
Yang Jing;Zhang Fuqiang
..............page:345-349
xin xi dong tai
..............page:350-352
© 2006 Oriprobe Information Services, Inc. All rights reserved
Tel: 1-519-977 9050 | Email:info@oriprobe.com
Home | Survey | Payment | Talks & Presentations | Job Opportunities