Thermosetting Resin 2001 Issue 3 THERMOSET COMPRESSION INJECTION MOLDING WITHOUT RUNNER

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Thermosetting Resin
1002-7432
2001 Issue 3

THERMOSET COMPRESSION INJECTION MOLDING WITHOUT RUNNER
HU Hai-qing

..............page:49-51

CARBON FIBERS AND COMPOSITE MATERIALS IN HEXEL CORPORATION，USA
ZHAO Jia-xiang

..............page:44-48

BISMALEIMIDE-TRIAZINE RESIN USED FOR PCB LAMINATE
ZHU Da-tong

..............page:38-43

THE LATEST DEVELOPMENT OF OXIDATION -REDUCTION INITIATOR SYSTEM USED FOR UP RESIN
MENG Ji-ru;ZHAO Lei;LIANG Guo-zheng;QIN Hua-yu

..............page:34-37

THE RESEARCH DEVELOPMENT OF CURING TECHNOLOGY AND CURING AGENTS FOR EPOXY RESIN
WANG Wei

..............page:29-33,37

RESEARCH PROGRESS OF RADIATION CURING MATERIALS
YANG Yong-yuan

..............page:22-28

EPOXY RESIN FOR APG AND ITS CURING CHARACTERISTICS
HE Yu

..............page:19-21

STUDY ON THE APPLICATION OF EPOXY RESIN FOR AUTOMATIC PRESSURE GELATION PROCESS
XUE Feng

..............page:16-18

STUDY ON QUALITY CHANGE OF CYCLOHEXENYL FORMALDEHYDE IN STORE
WO Shan-kang;YU Hao;LI Li-juan;ZHANG Zhong-wu;DONG Jin-wei

..............page:12-15

SYNTHESIS AND PROPERTY OF PU/EP/PPGDA/TERNARYINTERPENETRATING NETWORK ELASTOMER
ZHONG Fa-chun;FU Yi-bei;Gao Xue-min

..............page:9-11,28

STUDIES ON THE PHOTOCURING KINETICS OF POLYURETHANE-ACRYLATES
YUAN Hui-ya;WANG Zhi-ming;ZENG Zhao-hua;YANG Jian-wen;CHEN Yong-lie

..............page:5-8,18

STUDY ON CURING BEHAVIOR OF LIQUID CRYSTAL EPOXY/DIAMINE/CYD-128 SYSTEM Ⅱ PROPERTIES AND TOUGHENING MECHANISM
CHEN Li-xin;WANG Ru-min;CHANG Peng-shan

..............page:1-4