..............page:221-232
..............page:233-245
..............page:246-254
2-Space Bounded Online Cube and Hypercube Packing
Xiaofan Zhao;Hong Shen;School of Computer and Information Technology;Beijing Jiaotong University;School of Information Science and Technology;Sun Yat-sen University;School of Computer Science;University of Adelaide;
..............page:255-263
K0.5Na0.5NbO3-Based Self-Powered Pressure Sensor
Zhe Wang;Qingtang Xue;Yi Yang;Yi Shu;He Tian;Min Tang;Yu Huan;Xiaohui Wang;Janwen Luo;Tian-Ling Ren;Institute of Microelectronics;Tsinghua University;and Tsinghua National Laboratory for Information Science and Technology;Tsinghua University;State Key Laboratory of New Ceramics and Fine Processing;School of Materials Science and Engineering;Tsinghua University;Center for Biomedical Imaging Research;Tsinghua University;
..............page:264-269
The Use of Graphene-Based Earphones in Wireless Communication
Luqi Tao;Song Jiang;Cheng Li;He Tian;Ningqin Deng;Danyang Wang;Yi Yang;Tian-Ling Ren;Institute of Microelectronics;Tsinghua University;both the Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology;Tsinghua University;
..............page:270-276
Thermal Resistance Simulation for CoF Packages
Chuan Chen;Qian Wang;Xiaotian Meng;Lin Tan;Jian Wang;Chengqiang Cui;Jian Cai;Institute of Microelectronics;Tsinghua University;AKM Electronics Technology Company Ltd.;both the Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology;Tsinghua University;
..............page:277-284
..............page:285-292
..............page:293-305
..............page:306-315