Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Nanotechnology and Precision Engineering
1672-6030
2007 Issue 3
Fabrication Technology of a Novel Hydrophone Based on GaAs/AlAs Etch-Stop
TONG Zhao-min;XUE Chen-yang;ZHANG Bin-zhen;WANG Yong
..............page:230-234
Theoretical Analysis of Pattern Distortion in Proximity Lithography Based on Partial Coherent Light Theory
LI Mu-jun;SHEN Lian-guan;ZHENG Jin-jin;ZHAO Wei;LI Xiao-guang;LIU Li-ting
..............page:224-229
Nano-Precision Finishing Process Integrated with ELID-Grinding and MRF for Silicon Mirror
YIN Shao-hui;CHEN Feng-jun;ZHANG Dao-cheng;OHMORI Hitoshi;LIN Wei-min;UEHARA Yoshihiro
..............page:220-223
Preparation and Properties of Ni/Al2O3 Nano-Composite Coatings in High Magnetic Field
FENG Qiu-yuan;LI Ting-ju;ZHANG Zhong-tao;ZHANG Jian;LIU Mei;JIN Jun-ze
..............page:215-219
Preparation and Characterization of Nanocrystalline Silicon Quantum Dots Film
ZHANG Sheng-cai;WU Cheng-chang;XIAO Xia;WANG Yun-feng;YAO Su-ying;ZHAO Xin-wei
..............page:211-214
Nano-Vibration Cutting Process of Single Crystal Silicon by Molecular Dynamics
LI De-gang;BAI Qing-shun;LIANG Ying-chun;DONG Shen
..............page:205-210
Rotation Precision Calculation and Analysis of Typical Flexure Hinges
ZHANG Zhi-jie;YUAN Yi-bao;PIAO Wei-ying
..............page:200-204
Fabrication of Planar Resonant Tunneling Diodes
HU Liu-chang;GUO Wei-lian;ZHANG Shi-lin;LIANG Hui-lai
..............page:197-199
Color Edge Extraction of Data Obtained by Laser 3D Color Digitization Technique
SUN Yu-chen;GE Bao-zhen
..............page:177-181
Method of Measuring Parameters of Laser Holographic Labels for Anti-Counterfeit
MENG Zhuo;LIU Tie-gen;JIANG Jun-feng;HE Jin
..............page:173-176
In-Situ Monitoring and Study of Sacrificial Layer SiO2 Etching
LIANG Qing;YUAN Wei-zheng;YU Yi-ting;QIAO Da-yong
..............page:169-172
Face Recognition on Datasets of Various Scales
LIU Jin;ZHANG Le-shi;XU Ke-xin
..............page:164-168
Interfacial Reaction and Shear Properties of Lead-Free Sn3.5Ag Solder Bumps Reflowed by Induction Self Heating
XU Hong-bo;LI Ming-yu;KIM Jong-myung;KIM Dae-won
..............page:157-163
Trends and Frontiers of MEMS
GE Wen-xun;CONG Peng
..............page:182-189