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Adhesion in China
1001-5922
2015 Issue 8
zhong guo jiao zhan ji qi ye guo ji hua zhi lu zhan wang
shen wen bin ;
..............
page:23-23
xin qi dian xin zheng cheng xin gao feng -- cheng ming ke ji yuan luo cheng dian li zuo re rong jiao bo wu guan kai guan dian li long zhong ju xing
chen hui min ;
..............
page:24-25
kang da xin cai ni zeng mu zi 8.5 yi yuan you hua chan pin jie gou
..............
page:26-26
lang sheng tepex fu he cai liao zhu li a er bei si shan ji xian fei yue
..............
page:27-27
hei song lin xin li guan li huo ping quan guo qi ye wen hua you xiu an li liu peng kai dang xuan zhong qi lian wen hua wei fu zhu ren wei yuan
hu hong ;
..............
page:27-27
xin xi kuai bao
..............
page:28-29
shuang chuang guan jian shi ren cai
ma tie quan ;
..............
page:30-30
shuang chuang yao gan yu tu po jin qu
jiang bei ;
..............
page:31-31
Preparation of EVA modified urea-formaldehyde resin/stone powder composite materials
LIU Can;,ZHENG Yun-wu;,GU Ji-you;,HUANG Yuan-bo;,YANG Xiao-qin;,ZHENG Zhi-feng;
..............
page:33-37
On curing characteristic and resinification reaction of rubber seed shell liquefied products obtained with different catalyst
ZHENG Yun-wu;,LIU Can;,YANG Xiao-qing;,HUANG Yuan-bo;,ZHENG Zhi-feng;,GU Ji-you;
..............
page:38-43
Preparation of starch polyols adhesive
LIU Can;,GU Ji-you;,ZHENG Yun-wu;,HUANG Yuan-bo;,YANG Xiao-qin;,ZHENG Zhi-feng;
..............
page:44-47
Study on a temperature resistant node adhesive for fabrication of glass fibre honeycomb core
WANG De-zhi;,SU Kai;,QU Chun-yan;,LIU Li-zhu;,WANG Hai-min;
..............
page:48-51,47
Determination of heat-setting parameters of acrylic structural adhesives of laptop shell casing
DU Mei-na;,Nie Qi-si;,Huang Hai-jiang;
..............
page:52-54
An addition-curable silicone rubber with high temperature bonding properties
KONG Li-fen;,ZHAO Jing-gan;
..............
page:55-56
Preparation and performance of epoxy potting sealant with high thermal conductivity and high-temperature resistance
ZHOU Jin-qiang;,PAN Shi-rong;,HE Xiu-chong;
..............
page:57-58,54
Preparation and properties of bisphenol A type one-component benzoxazine on modified phenolic molding compound
ZHANG Bo;,WANG Ru-min;,HU Rui;,WANG Dao-cui;,QIANG Xue-yuan;
..............
page:59-63
Study on preparingof process silicone modified phenolic resins
LIJu;,SHI Zhen-hai;,ZHANG Duo-tai;
..............
page:64-67
Study on selection of catalysts of alkoxyl-terminated polysiloxane synthesis
ZHANG Zhen-yu;,CHEN Si-bin;
..............
page:68-70,78
Development of epoxy filling structural adhesives curable at low temperature
QU Xue-yan;,HU Sheng-xiang;,WU Huan;,CAO Xing-yuan;,QIN Rui-rui;,GONG Xiang-yi;,CHI Jian-yu;
..............
page:71-73,81
Comparison of gelatinization and peel strength of wheat starch and wheat flour
WU Wang-ting;,SHENG Yang;,SHI Ji-long;,LIU Dong-xue;,OUYANG Qi-ming;
..............
page:74-78
Preparation method of multi-function wallpaper base film
CAO Hui-ling;
..............
page:79-81
Progress of organic silicon-modified epoxy resins
ZHANG Luan;,PAN Heng;,KONG Zhi-xiang;,ZOU Lu-si;,ZHANGYang;,XIONG Xiao;,GUAN Rong;
..............
page:82-85
Research progress on grafted modification of soy protein adhesives
ZHU Chao;,FENG Bo;,SONG Meng-yao;,ZHANG Yu;,AI Zhao-quan;
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page:86-89