1001-5922
2015 Issue 5
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di si jie jian zhu jiao zhan ji zhuan ye ji shu yu xin xi yan tao hui cheng gong zhao kai
chen hui min ;
chen hui min ;
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..............page:24-25
cheng fa ti sheng mu de yao ming que
wu ming ;
wu ming ;
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ti yan shi an quan pei xun dang ti chang
wang dong ;
wang dong ;
..............page:27
Electrical conductivity of cyanate ester resin modified with highly loaded carbon-based materials
DING Juan;,HUANG Ying;
DING Juan;,HUANG Ying;
..............page:28-31,42
Preparation and properties of epoxy resin grafted acrylate emulsion
ZHANG Hong-Shuai;,ZHENG Shui-rong;,WANG Min;
ZHANG Hong-Shuai;,ZHENG Shui-rong;,WANG Min;
..............page:32-36
Polyethylene insulation composites with high thermal conductivity
QI Rong;,QI Shu-hua;,WANG Zhao-fu;,QIU Hua;
QI Rong;,QI Shu-hua;,WANG Zhao-fu;,QIU Hua;
..............page:37-42
Preparation and characterization of solvent-responsive P (St-BA-AA) polymer microspheres
CHEN Zhao-xia;,ZHANG Yu-hong;,DUAN Lan-lan;,WANG Zhi-guo;,HE Pei-xin;
CHEN Zhao-xia;,ZHANG Yu-hong;,DUAN Lan-lan;,WANG Zhi-guo;,HE Pei-xin;
..............page:43-46,60
Synthesis and application of UV-curable waterborne polyurethane acrylate resin
WANG Chao-dong;,YU Xin-hai;,LIU Wan-zhang;,CHEN Ji-wei;
WANG Chao-dong;,YU Xin-hai;,LIU Wan-zhang;,CHEN Ji-wei;
..............page:47-50
Synthesis of HPTC-CNTs and their influence on curing kinetics of BOZ/BMI
LI Ting-ting;,YAN Hong-xia;,FENG Shu-yao;,LIU Tian-ye;
LI Ting-ting;,YAN Hong-xia;,FENG Shu-yao;,LIU Tian-ye;
..............page:51-55,60
Effect of surfactants on microcapsules preparing process via in situ polymerization
YANG Xiao-na;,YU Jian-xin;,GAN Zhi-yong;,ZHANG Hao;,LIU Jie;,HUANG Hai-jiang;
YANG Xiao-na;,YU Jian-xin;,GAN Zhi-yong;,ZHANG Hao;,LIU Jie;,HUANG Hai-jiang;
..............page:56-60
Influence of diluent amount on curing kinetics of epoxy resin/low-temperature curing agent system
CUI Dong-xia;
CUI Dong-xia;
..............page:61-64,68
Preparation and application of one-component silyl-terminated polyether sealant
LI Ji-ming;,DENG Juan;
LI Ji-ming;,DENG Juan;
..............page:65-68
Application of new removable double-sided pressure sensitive adhesive tapes in electronic assembly industry
LIU Bo;,LI Jun;
LIU Bo;,LI Jun;
..............page:69-71
Preparation of the liquid sealant with oil resistance
TIAN Xue-shen;,YANG Meng;,QIAO Xue-dong;
TIAN Xue-shen;,YANG Meng;,QIAO Xue-dong;
..............page:72-74
Preparation and characterization of water-borne polyurethane laminating adhesive
MA Gang;,LIU Shu-lai;,LI Meng-qian;,MA Ling-ling;,XIAO Ji-jun;,GENG Yao-zong;
MA Gang;,LIU Shu-lai;,LI Meng-qian;,MA Ling-ling;,XIAO Ji-jun;,GENG Yao-zong;
..............page:75-76,71
Development and application of high peel strength structural adhesive
LI Cheng;,WANG Yong-ming;,GAO Zhi-xiang;,WU Zi-gang;,LI Shi-xue;,REN Wan-li;
LI Cheng;,WANG Yong-ming;,GAO Zhi-xiang;,WU Zi-gang;,LI Shi-xue;,REN Wan-li;
..............page:77-79
On factors of influencing solid content of waterborne polyurethane emulsions
LU Yan;,AI Zhao-quan;,CAI Ting;
LU Yan;,AI Zhao-quan;,CAI Ting;
..............page:80-85
..............page:86-88
Progress on research and development of polymer anchor bolts
ZENG Bing;,ZHU Ying-ying;,JIANG Guang-ming;,GONG Yu-jie;
ZENG Bing;,ZHU Ying-ying;,JIANG Guang-ming;,GONG Yu-jie;
..............page:89-92
Research and application of petroleum resin compatibility
DU Xin-sheng;,WANG Shan-wei;,XU Hui-jian;,LIU Cai-xia;,PAN Guang-qin;
DU Xin-sheng;,WANG Shan-wei;,XU Hui-jian;,LIU Cai-xia;,PAN Guang-qin;
..............page:93-95