..............page:34-37,42
..............page:43-46,75
..............page:47-50,55
..............page:56-60,64
Interface Structure and Bonding Properties of Cu/AlN Material Fabricated by Direct Bonded Copper Process
XIE Jian-jun;,WANG Yu;,WANG Tun;,WANG Ya-li;,DING Mao-mao;,LI De-shan;,ZHAI Tian-lei;,LIN De-bao;,ZHANG Lei;,WU Zhi-hao;,SHI Ying;
..............page:61-64
..............page:90-95,106
..............page:96-102,106
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