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Electronic Products China
1004-9606
2003 Issue 4
xin pin fa bu
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page:53-57
chang shang dong xiang
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page:84-87
ye jie dong tai
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page:69-83
te bie guan zhu
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page:61-68
jin ri zhi xing
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page:58-60
PRODUCT HGHLIGHTS
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page:48-52
Using single-chip for replacement of audio processing circuits
cirrus logic gong si
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page:46-47
Comprehensive DVD decoder family meeting future demands
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page:44-45
D class amplifiers saving battery life and suitable for portable products
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page:42-43
Enhanced DAC for audio applications
qian zuo kun
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page:40-41
Forecast of DVD player market
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page:39-39
Digital amplifier technology reshaping the consumer audio market
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page:38-39
Review audio power amplifiers for portable products
fang pei min
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page:35-37
Radiolocation technology in cellular communication systems
zhou jiang ; sun xian zuo
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page:33-34,32
Design a telecontrol device based on ultrasonic technology
deng zhong yi
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page:31-32
Using computer control system in waste water disposal system
liu song qing
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page:29-30
Interface of remote data collecting system is based on MSM7512B
zhang zhi jie ; zhu dian zuo
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page:28-28,24
Real time modulation of 2FSK signal based on sound card
liu shi gang ; duan tian dong
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page:25-27
DC/DC converter upgrade parallel operation
Gabriel Pietromonaco
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page:23-24
Measurement software is configurable and open
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page:21-22
Test and analysis of 100Base-TX inferface
tang shun wu ; zhou ying hang
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page:13-20
Design and analysis of smart antenna test-bed in a wide-band CDMA channel
zhang zhi yu
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page:11-12
Measuring cellular base station by NI TestStand
Jim Morrison;Chuck Patterson
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page:10-10,7
Selecting an instrument for RF power measurements
Robert Green
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page:8-9
Understanding the impact of interference on CDMA mobile receiver tests
Ryan Hendrickson
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page:5-7
DSP reaches new higher performance
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page:4-4
'All-silicon' process creates HV high-speed analog Ics
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page:4-4
Novel LED technology lowers contact resistance, instability
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page:3-3
Nitride transistor sets output record in sub-millimeter band
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page:3-3
Thin wafers as paper can be used for smart cards and RFID
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page:2-2
Folded-capacitor technology quadruples SRAM density
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page:2-2
Substrate technology empowers advanced LCDs
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page:1-1
Serial Attached SCSI spec moves toward implementation
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page:1-1