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Electronic Products China
1004-9606
2002 Issue 9
Reference design enables first 802.11 b, Bluetooth combo
..............
page:1-1
Tungsten lattice increases incandescent bulb efficiency
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page:1-1
Open specification facilitates power-line networking
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page:2-2
Ultrasonic crimp process increases contact surface area
..............
page:2-2
Nanoscale materials create ultrathin polarizer film
..............
page:3-3
Using one interface chip to control two smart cards
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page:4-5
Fan controller TC650 and TC651
..............
page:6-7
Merits and detects of using RTOS on MCU
wang tie yong ; wu pan long ; liu zhen bao
..............
page:8-9
AD and DA chip's application
zhao chang song
..............
page:10-10,5
Decrease ESD in PCB design
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page:11-12
How a power supply manages heat greatly affects device performance
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page:13-13
Low voltage and large current transformer's circuit technology
yue yun
..............
page:14-15,39
Load share controller improve performance and reliability of multi-module power supply
..............
page:16-17
Challenge, trend and sample for low voltage and large current power supply used in comm systems
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page:18-20
Progess of study on dye-sensitizer for NPC solar cell
yu ling yu ; feng yu ping
..............
page:21-23
Design RF CMOS bluetooth transceiver
Bob Koupal/Marshall Wang;Cory Edelman
..............
page:24-28
Test BGA package to meet RF application's requirement
..............
page:29-30
Fliters used in wireless devices
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page:31-31,30
Memory component target wireless market
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page:32-33
Products and technologies of crystal display
hu bing ; yue chun sheng ; zhao xin tian
..............
page:34-36
How to solve interference generated by cable
..............
page:37-38
lC and component market greatly enlarged
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page:39-39
Product Highlights
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page:40-46
ben kan te fang
..............
page:54-57
xin pin fa bu
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page:47-53
ye jie shi chang
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page:58-62