Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Aeronautical Manufacturing Technology
1671-833X
2011 Issue 17
Research of Vertical Power Spinning Machine
wang ya jun ; lin chun ting ; li ji zhen
..............page:62-65
Digital Measurement Solution for Metal Sheet Part
zhang yin yin ; liu qing run ; jia min ; zhang ya bing
..............page:96-98
Digital Measurement of Aircraft Digital Flexible Assembly
mei zhong yi ; zhu san shan ; yang peng
..............page:44-49
Key Technology of Aircraft Digital Flexible Assembly Line
guo hong jie
..............page:38-43
Airfoil Flow Field Reconstruction via Proper Orthogonal Decomposition
ye mao ; xu min ; yao wei gang ; liu hao
..............page:89-93
Application and Development of Rotor Design Technology for Helicopter
huang wen jun ; li man fu
..............page:32-35
deng jing hui zhi sheng ji xuan yi ji shu zhuan jia
Deng Jinghui
..............page:30-31
Cell Interaction Model for Product Development Activity
wang chun xia ; qin xian sheng ; cao yi ying
..............page:78-83
New Release of TNC 640 at EMO 2011
..............page:107
Research on Pin Load Distribution of Interference-Fit Composite Joint
liu feng lei ; liu dan ; liu jian guang
..............page:73-74,93
Advanced Polymer Matrix Composites for High Bypass Ratio Engines Application
shen er ming ; wang zhi hong ; zuo bai qiu ; li xiao xin
..............page:56-61
Better Efficiency for Pick-up
..............page:105
Development and Aviation Application of Automated Processes for Composite
shi yao yao ; yan long ; mo rong
..............page:26-29
Material Information Model Supporting Design Decision
liu yong zhen ; tong shu rong ; song de qiang
..............page:69-72
Research on Mechanical Properties of Continuous Basalt Fiber Reinforced Resin Composites
zheng zhi cai ; ge lin hai ; chen yan ; sun shi xiang ; wang qiang
..............page:66-68,72
xin xi dong tai
..............page:前插1,18,20,22,24,后插1
Simulation and Verification of Temperature and Current Density Distribution of BGA Package Solder Joint
xue ming yang ; wei guo qiang ; huang yan lu ; yao jian
..............page:75-77,93
New Standard of GF AgieCharmilles
..............page:102-103