Transactions of the China Welding Institution 2005 Issue 10 MAIN TOPICS,ABSTRACTS & KEY WORDS

..............page:113-118

Water cleaning technology for surface mounted components soldered with Sn-Ag-Cu solder
WANG Xu-yan;XUE Song-bai;WANG Hai-song;YU Sheng-lin

..............page:109-112

Effect of CPGA gull wing lead size on reliability of soldered joints
WU Yu-xiu;XUE Song-bai;HU Yong-fang

..............page:105-108

Effect of process parameters and interlayer on properties of 1420 Al-Li alloy diffusion bonded joint
CHEN Wen-hua;QIN Zhan-yan;SHEN Yi-fu

..............page:101-104

Study on strength of soldered micro-joints of QFP devices
HU Yong-Fang;XUE Song-bai;YU Sheng-lin

..............page:97-100

Effects of temperature and coatings on wettability of Sn-Ag-Cu lead-free solder
WANG Xu-yan;XUE Song-bai;YU Sheng-lin;ZHU Xiao-jun

..............page:93-96

Effect of diode-laser parameters on tensile strength of QFP micro-joints
YAO Li-hua;XUE Song-bai;WANG Peng;LIU Lin

..............page:90-92

Microstructures and properties of 7A52 aluminum alloy welded joint by twin wire welding
YU Jin;WANG Ke-hong;XU Yue-lan;LIU Yong

..............page:87-89

Low cycle fatigue property of TA5 titanium alloy welded joint
YAN Keng;ZHANG Pei-lei;JIANG Cheng-yu

..............page:84-86

Reliability of CBGA soldered joint under thermal cycling
XUE Song-bai;HU Yong-fang;YU Sheng-lin

..............page:81-83

FEM analysis of stress and strain in CBGA soldered joint with different size under thermal cycle
HU Yong-Fang;XUE Song-bai;YU Sheng-lin

..............page:78-80

Interface strengthening process of Cr plating layer by plasma beam
WANG Ke-hong;ZHANG Chun-yang;ZHU Ping;Gu Min-le;ZHU Wu-ying

..............page:75-77

Effects of lead-free solder on the tensile strength of QFP micro-joints soldered with different pitchs
HU Yong-Fang;XUE Song-bai;SHI Yi-ping;YU Sheng-lin

..............page:72-74

Liquid spreading and microstructure of Ti/Cu eutectic reaction
WU Ming-fang;YANG min;ZHANG Chao;YANG Pei;MA Cheng

..............page:68-71

A new rotating arc process for narrow gap MAG welding
WANG Jia-you;GUO Hong-bin;YANG Feng

..............page:65-67

Study on shear strength of soldered joints of BGA packaging devices
XUE Song-bai;HU Yong-Fang;YU Sheng-lin

..............page:62-64

Si3N4 ceramics brazing with composite soldering materials
ZHANG De-ku;WU Ai-ping;ZOU Gui-sheng

..............page:59-61

A-TIG Weld analysis of AZ31 Magnesium alloy
XU Jie;LIU Zi-li;SHEN Yi-fu;CHEN Wen-hua

..............page:54-58

Research of Ti-Zr-Ni-Cu based amorphous brazing material
ZOU Jia-sheng;XU Zhi-rong;JIANG Zhi-guo;ZHAO Qi-zhang

..............page:51-53

Effect of N2 on wettability of Sn-Ag-Cu solder on components/devices lead frame and lead-free coating
LIU Lin;XUE Song-bai;XU Wen-da;YAO Li-hua

..............page:47-50

Thermodynamical analysis of active SiO2 in interfacial chemical reaction between slag and liquid metal based on thermal-dynamic coupling
LI Xiao-quan;YANG Xu-guang;FANG Chen-fu

..............page:43-46

Brazing technology of aluminium alloy containing scandium
WANG Shao-gang;XIANG Ding-han;ZHENG Yong

..............page:39-42

Weld workpiece model design system based on feature
LIU Yong;WANG Ke-hong;XU Yue-lan;YANG Jing-yu;YU Jin

..............page:35-38

Optimization of twin wire automatic welding process for dissimilar Al-alloy
xu yue lan ; wang ping ; liu yong ; hong qing

..............page:31-34

Measurement and analysis of the eutectic aluminum alloys of 6082 and Zl101
LIU Ren-pei;DONG Zu-jue;PAN Yong-ming

..............page:27-30

Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder
XUE Song-bai;LIU Lin;DAI Yong-feng;YAO Li-hua

..............page:23-26

Visual inspection of heated area on Cr plating layer surface by plasma beam
WANG Ke-hong;ZHU Ping;ZHANG De-ku;ZHU Wu-ying;GU Min-le

..............page:19-22

Double close loops control system of peak current mode of inverter arc welding power supply
FANG Chen-fu;YIN Shu-yan;HOU Run-shi;YU Ming;WANG Jin-cheng

..............page:14-18

Dynamic cracking behaviors of weld solidification cracks for aluminum alloys at elevated temperature
LIU Ren-pei;DONG Zu-jue;PAN Yong-ming

..............page:9-13

Rich argon protecting welding CAPP system development
WANG Ke-hong;HAN Jie;LI Shuai;WANG Jia-jun

..............page:5-8

Effect of cerium on wettability and mechanical properties of soldered joints for Sn-Ag-Cu lead-free solder
XUE Song-bai;CHEN Yan;LV Xiao-chun;LIAO Yong-ping

..............page:1-4