Electronics Quality 2003 Issue 10 The Cause of Reason of ofidable black dot in PCBA board

The Cause of Reason of ofidable black dot in PCBA board
zhong guo sai bao shi yan shi ke kao xing yan jiu fen xi zhong xin

..............page:77-77

Communication System Design Of Interactive Micro-robot Contest Platform
heng jin ; zhang hou xiang ; zong guang hua ; liu rong

..............page:78-80

Design Of CAN Communication Card Based On PC104 Bus
luo shi tu ; zhang ; luo fei lu ; wang yan ling

..............page:81-83

IC News

..............page:84-87,68

Communication News

..............page:88-91,83

The Cause of PCBA failure layer blister's reason
zhong guo sai bao shi yan shi ke kao xing yan jiu fen xi zhong xin

..............page:76-76

The Cause of Black Pollutant and source of PCBA board
zhong guo sai bao shi yan shi ke kao xing yan jiu fen xi zhong xin

..............page:75-75

IR Pull Super small optimization DireetFET MOSFET chip

..............page:74-74

USA National Semiconductor Pull high Integer Four Ports Gigabit Ethernet PHY RX and TX equipment

..............page:74-74

Broadcast Television Power Supply Integrally Protective Project in the shooting Room
shang hai pan deng dian yuan you xian gong si

..............page:72-73

Data Store Lnterface Techruslogy Of Vast Large Capacity FLASH & DSP
deng liang hui ; liang guo long

..............page:69-71

Multi-Function Periphery Chip CH451 And Its Application
zuo zhi hao ; zhao wang da ; li zuo

..............page:66-68

The Character And Application Of The Noise In Thick-Film Resistors
hu zheng ; du lei ; zhuang zuo zuo

..............page:64-65,63

An Electromagnetic Measuring System Based On Multi-sensor Fusion
xu xiao ming

..............page:61-63

Principle Of Chip TLC5615 And Its Application Of Interface With DSP
zhu geng jun ; peng yong gong ; xiang an ; hu kai

..............page:59-60

How To Improve Die Shear Strength And Bond Strength
li ping ; zhang xiao ming

..............page:58-58,52

Center Of Analysis Purpose Of The Whole Profession
li shao ping

..............page:55-57

Thermal Simulation Method Of Electronic Module With ANSYS
qiu bao jun

..............page:53-54,71

Components Quality And Reliability Growth By Process Technology Assurance
huang yun

..............page:49-52

Quality News

..............page:45-47

Learning from Quality Doctor

..............page:44-44

The Research of Calibration Method For Iron Loss Tester(1)
ye fen bin ; qian jing bo wen ; chen zhi ming ; luo jin

..............page:20-21

The Design Of Control System Using Single-chip Microcomputer In The Perfusion-Machine System
zheng chang yong ; jiang jian ping ; wang shi sheng

..............page:8-10

The Design Of Voltage Measure Based On V/F Converter
song xiang li

..............page:11-12

The Priciple and Application of AC Asynchronous Motor Intelligent Soft-starfer
liu mei jun ; ran li li

..............page:13-14,10

The Application of Fieldbus to An Automobile Product Logistics System
huang zuo gang ; zuo xiao ping ; jiang zuo

..............page:15-16

Application Of Embedded Operation System μ C/OS-Ⅱ In Power System Status Monitor
xiong zhi jin ; chen san bao ; guo hong na

..............page:17-19

Introduces QCC Activity's Characteristic and Advance Method
fu hai jian

..............page:42-43,41

Software Reliability Testing Technology And Application
li dan ; liu jie

..............page:38-41

Electrical equipment usually problem and solution methad in detecting

..............page:37-37,47

Control and Improvement of Inspection Process In the Electronic Manufacture
zhu liang

..............page:34-36

Conductive Transient Emission of Onboard Electrical and Electronic Equipment and Equipment's Resistance to Transient Disturbance(2)
qian zhen yu

..............page:28-33

EMC Analysis of Layout in PCB Design
zhou li ; lu hong min ; xia chang ming

..............page:26-27

Information & Trends

..............page:23-25,16

Realization of new Type pure wave stabilizator

..............page:22-22

Ti pull 32 bit level switch transforming 1.5v to 3.3v

..............page:22-22