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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronic Components & Materials
1001-2028
2012 Issue 1
Research progress of A4B3O12-type hexagonal perovskite microwave dielectric ceramics
LIAO Wei;FANG Liang;ZHOU Huanfu;SU Congxue;LIU Xiaobin
..............page:83-86
X-ray detection and analysis for micro voids of solder joints in density LED packages
WANG Xinxin;LIU Jianping;GUO Fu;LIU Li;FU Channi
..............page:64-67
Study on barium lanthanum titanium series high permittivity ceramics
ZHANG Hongxia;ZHOU Shiliang;FENG Qingxue
..............page:12-14
Study on parallel plate capacitor based on a new type of dielectric elastomer
LIU Xiaohua;HUI Anfeng;TAO Bairui
..............page:44-46
Study on the gas sensing properties of CuPc/ZnO hybrid materials
LOU Xiangdong;WEN Yun;WANG Xiaobing;WANG Quankun;SU Xianfa
..............page:15-19
Application of carbon nanomaterials in thermal conductive polymer based composites
ZHAO Chunbao;WANG Xin;YANG Xujie
..............page:78-82,86
Design of a band-notched ultra-wide band antenna based on SRR structure
SUN Ronghui;GAO Weidong;LIU Han;SHEN Xu
..............page:47-50
Research advances in the interfacial IMC between the Sn-based solders and Cu substrate
WEI Song;YIN Limeng;XU Zhangliang;LI Xinlin;LI Wangyun
..............page:73-77
Effects of Nb2O5 doping on the properties of ZnO varistors
YANG Xiaoni;FU Gang;CHEN Huan;ZHAI Wangjian;LIU Zhiyu
..............page:20-23
structural modification and gas-sensing properties of HoCoO3 nanomaterials
DENG Dehua;DU Weimin;ZHU Zhaoqiang;WEI Juan;GUO Jinfu
..............page:24-28
Preparation of electromagnetic band-gap materials using low temperature co-fired ceramic technique and its properties study
LI Bo;ZHANG Xiaoqing;CHEN Bingyang;MENG Lingbao;PANG Xinfeng;SUN Jingbo;WU Jun;GUO Hai;ZHOU Ji;LI Longtu
..............page:1-3
Effect of Si substitution on microwave absorbing properties of NdFeB magnetic powders
WANG Lei;HU Shiqi;LIN Peihao;PAN Shunkang
..............page:8-11
Screen design of aero-components\' limit assessment test
WU Junqiang;DONG Yuliang;ZHANG Xiaochuan;ZHANG Hongwei
..............page:59-63,67
Investigation on board-level process adaptability of low-Ag lead-free solder paste
ZHANG Han;LEI Yongping;LIN Jian;YANG Jinli
..............page:55-58
Synthesis and capacitance properties of NiO/EG composite
CHEN Zhidong;GU Xiaofang;CAO Jianyu;WANG Wenchang;XU Juan
..............page:40-43
Research progress of wafer level package
LIU Peisheng;TONG Liangyu;HUANG Jinxin;SHEN Haijun;SHI Jiangen;ZHU Haiqing
..............page:68-72
Optimized design of the wave-absorbing coating made of carbonyl iron powders
YAO Jianping;JIANG Jianjun;BIE Shaowei;ZHANG Chuankun;CHEN Xuming
..............page:29-31
Modeling the electrical characteristics of via-holes in package substrate
YANG Lingling;SUN Ling;SUN Haiyan;WANG Shenglong
..............page:51-54
xin xi dong tai
..............page:7,23,28,39,43,54,72,77
Investigate of defoaming method in the synthesis of ultrafine silver powders used in PTC electrode paste
TAN Jing;LEI Yuewen;ZHANG Hu;HUO Ying;XIE Shihui
..............page:32-35
Solutions for the noise of flatmetallized film capacitors
FAN Hongjie
..............page:36-39