EDN China 2003 Issue 5 Processors

Processors

..............page:104-104

Analog & Mixed Signal Devices

..............page:102-102

Power Technology

..............page:98-99

Memories and storage Devices

..............page:98-98

Test & Measurement

..............page:96-96

Wireless Network and Devices

..............page:96-96

EDA tools & Design Services

..............page:96-96

Hot Products

..............page:90-94

VCO uses programmable logic

..............page:88-88

Use a 555 timer as a switch-mode power supply

..............page:86-86

Power circuit terminates DDR DRAMs

..............page:84-84

DPP adds versatility to VFC

..............page:82-82

Exend the input range of a low dropout regulator

..............page:81-81

zai he shi de ying jian ping tai shang jian li ce liang xi tong

..............page:78

xin de xi tong ji she ji yu yan wei soc she ji zheng he ti gong liang hao de kai fa huan jing

..............page:78

shen ya wei mi soc xin pian she ji ji qi gong ying lian de guan li

..............page:78

zhen dui dsp ying yong she ji de xi tong cun chu qi

..............page:76-78

usb dian lu bao hu she ji fang an

..............page:76

zhen dui qian ru shi kong zhi xi tong she ji de fang da qi

..............page:76

ti gao tong bu zheng liu qi xiao lv de xian jin men qu dong qi ic ji shu

..............page:76

Sanyo Electric introduces low power CCD image sensor modules

..............page:46-46

Cypress' 10G Ethernet framer is used in 10Gb enterprise network design

..............page:33-34

Rockwell supplies automation solutions

..............page:33-33

Philips introduces SoC LCOS back-projection solution

..............page:33-33

Tektronix sets up factory in Shanghai to produce digital oscilloscopes

..............page:32-32

Streaming Networks provides HD recorder reference design for the China market

..............page:32-32

StarGen introduces StarFabric interconnecting technology

..............page:30-30

Agere supplies multi-mode chipsets with RF power transistor, network processor and dual-frequency transceiver

..............page:30-30

Ericsson's two environment-friendly modules feature low price

..............page:28-30

Silicon Wave releases its 3rd generation Bluetooth chip with high performance and low price

..............page:28-28

Linear Technology brings its power technology to China's communications market

..............page:28-28

TI provides interconnecting solutions for multi-markets

..............page:26-26

Infineon offers power management products

..............page:26-26

HARTING's connectors find new applications

..............page:24-24

ST exhibits smart power products

..............page:24-24

xin wen

..............page:20-22

People in the Industry

..............page:18-20

Good-bye reliability?

..............page:16-16

"Gentle" market requires deep adjustments

..............page:14-16

yong gong mo e liu quan yi zhi yin pin xin hao zhong de zao sheng

..............page:70-74

Automation frees high-speed design

..............page:62-68

Design for test or suffer the consequences

..............page:56-60

NEC succeeds in developing 100 million gates LSI

..............page:46-46

lian jia xiao xing chuan gan qi ic zhi chi re guan li

..............page:44-46

yong lai jian yan ji yu pci-x she ji de yan zheng gong ju

..............page:44-44

yong lian jia pin pu fen xi yi ce liang xian jin she pin

..............page:44-44

Signal processors offer improved images in dimly lit environments

..............page:42-44

Ics integrate 8-bit I/O expander with 2 Kbit serial EEPROM

..............page:42-42

40-Gbps frame processor supports SONET OC-768 router and switch interface

..............page:42-42

jian xun

..............page:36-38

HP migrates from EDA OS to Linux

..............page:36-36

Sharp supplies 16-/32-bit BlueStreak general purpose MCU for the China market

..............page:34-36

Taiwan's Ali enters wireless communications chip market

..............page:34-34

Destination distortion

..............page:48-54