1001-3474
2016 Issue 5
Design of LED Filament Bulb with Triangle Glass
ZHANG Hong-lin;,ZHANG Xi-kui;,OU Yan-jie;,WU Yi-ping;
ZHANG Hong-lin;,ZHANG Xi-kui;,OU Yan-jie;,WU Yi-ping;
..............page:249-252
Research Progress and Prospect of Package Technology for Flexible Electronics
WANG Gao-zhi-quan;,HE Xin-yi;,TANG Hong-wei;,XIE Zi-jian;,ZHAO Yi;,XIA Wei-sheng;
WANG Gao-zhi-quan;,HE Xin-yi;,TANG Hong-wei;,XIE Zi-jian;,ZHAO Yi;,XIA Wei-sheng;
..............page:253-256,263
Study on Technology of Thin Film Mutli-layer Wiring
LIU Yong-biao;
LIU Yong-biao;
..............page:257-259
Investigation of Epoxy Resin Bleeding on LTCC Substrate
WU Yi-long;,LI Yue;,SHU Ping;
WU Yi-long;,LI Yue;,SHU Ping;
..............page:260-263
Lithography Study of Photosensitive Benzocyclobutene
WANG Feng-dan;,WANG Ying;,LIU Min;,FU Xue-cheng;,LI Jin-xi;,SHEN Yun-liang;,MA Ling;
WANG Feng-dan;,WANG Ying;,LIU Min;,FU Xue-cheng;,LI Jin-xi;,SHEN Yun-liang;,MA Ling;
..............page:264-266,310
Study on Soldering Process of Microwave Power Modules
YANG Hai-hua;,YANG Tao;,ZHANG Wei;
YANG Hai-hua;,YANG Tao;,ZHANG Wei;
..............page:267-269,302
Research of Large Area Substrate Eutectic Bonding with Solder Paste for Micro-assembly
YANG Zong-liang;,ZHANG Chen-xi;
YANG Zong-liang;,ZHANG Chen-xi;
..............page:270-272,286
Investigation on Jet Printing Parameter of Paste during Refl ow Process
ZHU Yong-xin;,CHANG Shuo;
ZHU Yong-xin;,CHANG Shuo;
..............page:273-274,279
Automatic Crimping of PCB Electrical Connectors for Satellite Electronic Products
HE Xiao-bin;,ZHANG Shi-ming;,LIU Shuang-bao;,YANG Shi-hua;
HE Xiao-bin;,ZHANG Shi-ming;,LIU Shuang-bao;,YANG Shi-hua;
..............page:275-279
Assembly Technology for Stacked Micro-strip Circuit Boards in T/R Module
CHENG Pi-jun;,LI Hui;,RU Li;
CHENG Pi-jun;,LI Hui;,RU Li;
..............page:280-282
..............page:283-286
..............page:287-290,294
Research on Foreign Body Breeding of PCBA with Protection Coatings
LEI Jun;,LI Jian;,WU Xiao-jun;,LI Jin;,ZHOU Xun-lei;
LEI Jun;,LI Jian;,WU Xiao-jun;,LI Jin;,ZHOU Xun-lei;
..............page:291-294
Soldering Technology Improvement for Surface Acoustic Wave Filter(SWAF)
TANG Jie;,JIN Kai-lin;,WANG Hai-bo;
TANG Jie;,JIN Kai-lin;,WANG Hai-bo;
..............page:295-298
..............page:299-302
Study on Test Parameters of DC Bias Characteristics of MLCCs
LIAO Qing-wen;,ZHUO Jin-li;,LU Heng;,AN Ke-rong;
LIAO Qing-wen;,ZHUO Jin-li;,LU Heng;,AN Ke-rong;
..............page:303-304,306
15.24 cm 6 ying cun gao chun ban jue yuan 4h-sic dan jing sheng chang
wang ying min ;, wei ru sheng ;, li bin ;, xu wei ;, wang li zhong ;, fan yun ;, zhang lei ;
wang ying min ;, wei ru sheng ;, li bin ;, xu wei ;, wang li zhong ;, fan yun ;, zhang lei ;
..............page:305-306
Management of Green Supply Chain in Electronic and Electrical Products (the end)
JIA Bian-fen;,LV Shu-zhen;
JIA Bian-fen;,LV Shu-zhen;
..............page:307-310