1001-3474
2015 Issue 6
Effect of Refl owing Atmosphere on Mechanical Properties of Sn-3.0Ag-0.5Cu Pb-free Solder Joints
TIAN Shuang;,WANG Feng-jiang;,HE Peng;,ZHOU Yin-hao;
TIAN Shuang;,WANG Feng-jiang;,HE Peng;,ZHOU Yin-hao;
..............page:311-314
SnO2 Transparent Conductive Film in Doping Research Progress
LIU Yong-mei;,ZHAO Ling-zhi;,LIU Xue-hua;
LIU Yong-mei;,ZHAO Ling-zhi;,LIU Xue-hua;
..............page:315-318
Study of Self-Heating Soldering in LTCC
XU Yang;,LIU Zhi-hui;,YUE Shuai-qi;
XU Yang;,LIU Zhi-hui;,YUE Shuai-qi;
..............page:319-322
RF SiP Design Based on Silicon Integrated Passive Device
LUO Ming;,WANG Hui;,LIU Jiang-hong;,DAI Wen-liang;
LUO Ming;,WANG Hui;,LIU Jiang-hong;,DAI Wen-liang;
..............page:323-326,342
Soldering Process of Solder Charge Connector
REN Kang;,JIAO Chao-feng;,ZHANG Feng-hua;,YANG Lin;,LIU Bing-jin;
REN Kang;,JIAO Chao-feng;,ZHANG Feng-hua;,YANG Lin;,LIU Bing-jin;
..............page:327-329,334
AOI Technology of Chip Component After Refl ow Soldering for Aerospace Product
ZHENG Yi;,LI Hua;,YANG Yi-feng;,WANG yan;
ZHENG Yi;,LI Hua;,YANG Yi-feng;,WANG yan;
..............page:330-334
Use and Installation Requirements about Chip Tantalum Electrolytic Capacitors in Aerospace Products
WANG Yu-long;,LI Jing-mei;
WANG Yu-long;,LI Jing-mei;
..............page:335-338
Orthogonal Experimental Analysis of Wave Soldering Process Parameters on Bridging
WU Wei-hui;,CHEN Ji;,CHEN Peng;,ZHOU Feng;,PAN Xiang-hu;
WU Wei-hui;,CHEN Ji;,CHEN Peng;,ZHOU Feng;,PAN Xiang-hu;
..............page:339-342
Design Optimization Used for Resolving Metal Line Distortion and Bridge Problem
XU Zong-neng;,LI Jian;,LI Yong;,ZHANG Lei;,WANG Jie;
XU Zong-neng;,LI Jian;,LI Yong;,ZHANG Lei;,WANG Jie;
..............page:343-346
Research on Reliability Evaluation of Flip-Chip Package
ZHANG Yong-hua;,WU Ning-biao;,LI Xiao-ming;
ZHANG Yong-hua;,WU Ning-biao;,LI Xiao-ming;
..............page:347-350,357
Soldering Technology of Microwave Module With Chemical Nickel Plating
CUI Hong-bo;,CHEN Liang;,GUO Qian;
CUI Hong-bo;,CHEN Liang;,GUO Qian;
..............page:351-353,366
Research on Infl uence of Silicon Wafer Affected Layer to CMP Removal Amount
WANG Yun-biao;,TIAN Yuan;,YANG Zhao-jie;,GUO Ya-kun;
WANG Yun-biao;,TIAN Yuan;,YANG Zhao-jie;,GUO Ya-kun;
..............page:354-357
Research on Electron Beam Welding of a Slow-wave Line Forming Method
XU Shu-cheng;,FENG De-gui;
XU Shu-cheng;,FENG De-gui;
..............page:358-360
..............page:361-363,369
Welding Processing of Large-scale Aluminum Alloy
LI Huai-zhu;
LI Huai-zhu;
..............page:364-366
..............page:367-369
..............page:370-371
..............page:371-372