1001-3474
2015 Issue 3
Research on BGA Ball Mounter of BGA Rework Chips Mass Production
LIU Jin-song;,SHI Wei;,ZHANG Jin-zhi;
LIU Jin-song;,SHI Wei;,ZHANG Jin-zhi;
..............page:125-128
Rheology Study of Silver Pastes and Their Application in Screen Printing for Solar Cell Front Side Metallization
NIU Yu-jiao;,YANG Zhi-hao;,HUANG Shao-ming;
NIU Yu-jiao;,YANG Zhi-hao;,HUANG Shao-ming;
..............page:129-133,149
Mechanical Properties and Structure Character of Sn-3.5Ag-0.5Cu Lead-free Solder
LI Shao-liang;,ZONG Xiao-ming;,WANG Jun-tao;,YANG Li-guang;,MA Yan-bo;
LI Shao-liang;,ZONG Xiao-ming;,WANG Jun-tao;,YANG Li-guang;,MA Yan-bo;
..............page:134-137,162
Controlling Void in Solder Joint of LP Packaging on Ni/Au Surface
LIAO Yu-tang;,ZHAO Shao-wei;,TANG Xiao-rong;
LIAO Yu-tang;,ZHAO Shao-wei;,TANG Xiao-rong;
..............page:138-140,171
Effect of Different Hot Press System on Dimension Control and Dielectric Thickness of PCB
LUO Yong-hong;,WU Rui-huang;,HUANG Jian;
LUO Yong-hong;,WU Rui-huang;,HUANG Jian;
..............page:141-145,157
Improvement Method Study on Low Yield Failure of Bipolar Product Induced by Alloy Dot in MCD Process
QIU Yan;,CHEN Qian;,ZHANG Ai-jun;
QIU Yan;,CHEN Qian;,ZHANG Ai-jun;
..............page:146-149
Electrochemical Migration Phenomenon Research of Hot Air Leveling Solder Coating
SUN Jing-jing;,XU Huo-ping;,WANG Chen;
SUN Jing-jing;,XU Huo-ping;,WANG Chen;
..............page:150-153
Manual Method of Removing and Soldering for QFP
LI Jiu-feng;
LI Jiu-feng;
..............page:154-157
Cabling of Movable Cable in Limited Space
HUANG Peng;,ZHANG Yun-long;,ZHANG Wei-ping;,GUO Jian;,REN Jin-peng;,XUE Fei;
HUANG Peng;,ZHANG Yun-long;,ZHANG Wei-ping;,GUO Jian;,REN Jin-peng;,XUE Fei;
..............page:158-162
..............page:162
Definition for SPC Control Limits and Specifi cation Limits
LI Bao-di;,LI Yan-wei;,SUN Tian-ling;,YAN Rui;,CUI Yu-xing;,FU Xing-chang;
LI Bao-di;,LI Yan-wei;,SUN Tian-ling;,YAN Rui;,CUI Yu-xing;,FU Xing-chang;
..............page:163-164,182
Preparation and Characterization of Heat Resist Silicone Resin Containing Reactive End Group
JIANG Hai-jian;,SU Gui-ming;,CHEN Ming-yue;,ZHANG Xiao-chen;,ZHANG Wei-jun;
JIANG Hai-jian;,SU Gui-ming;,CHEN Ming-yue;,ZHANG Xiao-chen;,ZHANG Wei-jun;
..............page:165-167
Reason Analysis and Improvement of Locking Bolt Cylinder Rod Break for ZCP-4 Clave Machine
JIA Song-lin;
JIA Song-lin;
..............page:168-171
A Design of Visual Identifi cation Technology for Accurate Winding of Optical Fiber
ZHANG Wan-cheng;,YE Ze-qun;
ZHANG Wan-cheng;,YE Ze-qun;
..............page:172-174,178
Study on Statistical Tolerance Analysis of Plane Array Precision
XU Ye-lin;,ZHANG Chong;,JIANG Hai-dong;
XU Ye-lin;,ZHANG Chong;,JIANG Hai-dong;
..............page:175-178
Design and Research of Partial Load Lifting Mechanism for Automatic Clave Machine
ZHANG Jun;,YANG Zi-xia;,CHEN Jing;,GAO Zhi-gang;,JIA Ping-ping;
ZHANG Jun;,YANG Zi-xia;,CHEN Jing;,GAO Zhi-gang;,JIA Ping-ping;
..............page:179-182
Manual Soldering Process Technology ( continued )
SHI Jian-wei;,TAN Zheng-dong;,ZHOU Xuan;,SU Li-jun;,DU bin;
SHI Jian-wei;,TAN Zheng-dong;,ZHOU Xuan;,SU Li-jun;,DU bin;
..............page:183-186