1001-3474
2014 Issue 6
Research of Ultra-high-power LED Light Source Based on Diamond Thermal Structure
CHEN Xin;,WU Yi-ping;
CHEN Xin;,WU Yi-ping;
..............page:311-315
geng zheng
dian zi gong yi ji shu bian ji bu ;
dian zi gong yi ji shu bian ji bu ;
..............page:315-315
Effect of Alloying on Sn-Zn Lead-free Solder Corrosion Resistance
LIU Mou-miao;,MA Yue-yuan;,YANG Wen-chao;,YU Mei-hua;,ZHANG Yong-zhong;
LIU Mou-miao;,MA Yue-yuan;,YANG Wen-chao;,YU Mei-hua;,ZHANG Yong-zhong;
..............page:316-320
Simulation of Micro Focal Spot X-ray Tubes Electron Emission System in Two-dimensional Field
HU Jing-wen;,LIU Jun;,LV Wei-wen;
HU Jing-wen;,LIU Jun;,LV Wei-wen;
..............page:321-325,370
Study on Interfacial Reaction Behavior and Properties of Al/Zn-3Al/Cu Fluxless Brazed Joint
DU Bin;,FU Yong-gao;,GAO Rui;,WAN Chao;,WANG Ling;,XIAO Yong;
DU Bin;,FU Yong-gao;,GAO Rui;,WAN Chao;,WANG Ling;,XIAO Yong;
..............page:326-329,333
Study of Surface Mounting Device and DIP Device Solder Joint Reliability During Thermal Cycle Process
DING Ying;,DONG Yun-song;,FEI Jing-ming;,HANG Chun-Jing;,ZHOU Ling;
DING Ying;,DONG Yun-song;,FEI Jing-ming;,HANG Chun-Jing;,ZHOU Ling;
..............page:330-333
Development of High Overload Resistant LTCC Integral LCC Package
HE Biao;,HE Zhong-wei;,LI Jie;,LU Dao-wan;,ZHOU Dong-lian;
HE Biao;,HE Zhong-wei;,LI Jie;,LU Dao-wan;,ZHOU Dong-lian;
..............page:334-336,340
Study on Process Technology of Making LTCC Screen
CHEN Lei;,LIU Yao;,LU Hui-xiang;
CHEN Lei;,LIU Yao;,LU Hui-xiang;
..............page:337-340
Inlfuence of Lunar Surface Temperature on Materials Used in Space Cable Assembly
CHEN Ya-rong;,HE Zong-peng;,YANG Fu-jing;,YANG Meng;,ZHANG Xiao-chao;,ZHANG Zhen-ming;
CHEN Ya-rong;,HE Zong-peng;,YANG Fu-jing;,YANG Meng;,ZHANG Xiao-chao;,ZHANG Zhen-ming;
..............page:341-344
Key Mount Technology of Microwave Module
CHENG Zhi-yuan;,HU Quan;,LIU Jun-dong;,LIU Li-an;
CHENG Zhi-yuan;,HU Quan;,LIU Jun-dong;,LIU Li-an;
..............page:345-349,357
Research on Pressure Soldering Connection Technology
SUN Shou-hong;,ZHANG Wei;
SUN Shou-hong;,ZHANG Wei;
..............page:350-352,367
DR-QFN Soldering Process
LI Zhen-yu;
LI Zhen-yu;
..............page:353-357
One Method of Modifying PCB
LI Xiang-chen;,MAO Shu-qin;,WEN Da-hua;,WU Jin;
LI Xiang-chen;,MAO Shu-qin;,WEN Da-hua;,WU Jin;
..............page:358-360,370
..............page:361-363
Adhering Process Technology of Polytetralfuoroethylene (PTFE) and Aluminium
CHEN Ping;,YIN Gui-rong;
CHEN Ping;,YIN Gui-rong;
..............page:364-367
Manual Soldering Process Technology (continued)
DU bin;,SHI Jian-wei;,SU Li-jun;,TAN Zheng-dong;,ZHOU Xuan;
DU bin;,SHI Jian-wei;,SU Li-jun;,TAN Zheng-dong;,ZHOU Xuan;
..............page:368-370
..............page:371-371
..............page:372-372