1001-3474
2014 Issue 3
Effects of Film Former on Properties of Low Rosin Soldering Flux
FAN Huan;,WU Dao-zi;,YANG Ya-jing;,ZHAO Mai-qun;
FAN Huan;,WU Dao-zi;,YANG Ya-jing;,ZHAO Mai-qun;
..............page:125-127,163
Micro-package Process Statistic Characterization and Optimization by Design of Experiment
LI Zhong-yun;,ZHOU Lin;
LI Zhong-yun;,ZHOU Lin;
..............page:128-130,181
Development and Research of High Properties Resistor Paste for Thick Film Circuit
HAO Wu-chang;,LIU Min-xia;,LU Dong-mei;,SUN She-ji;
HAO Wu-chang;,LIU Min-xia;,LU Dong-mei;,SUN She-ji;
..............page:131-136
Analysis of Factors influencing Wettability of QFN Side Pad
LIU Gang;,WANG Xu-yan;
LIU Gang;,WANG Xu-yan;
..............page:137-139
Application of High-density Wire Harness to Aerospace Product
MIAO Ke;,SONG Dong;
MIAO Ke;,SONG Dong;
..............page:140-143
Selection and Implementation of Soldering Process of Military Lead-free BGA Device
CHEN Kai;,LIU Peng-cheng;,WANG Wen-bo;
CHEN Kai;,LIU Peng-cheng;,WANG Wen-bo;
..............page:144-147
Study on Automatic Alignment of Non-Standard Stencil Printing
LIU Jian;,SUN Shou-hong;,WANG Yu-long;,ZHANG Yan-peng;
LIU Jian;,SUN Shou-hong;,WANG Yu-long;,ZHANG Yan-peng;
..............page:148-150
Fabrication Technology of Double-face Cavities in LTCC Substrate
LU Hui-xiang;,TANG Xiao-ping;,YAN Ying-zhan;
LU Hui-xiang;,TANG Xiao-ping;,YAN Ying-zhan;
..............page:151-153,177
Mechanism of Discolored Conductive Adhesives and Effect on Contact Resistance in Microwave Device
CHEN Jie;
CHEN Jie;
..............page:154-156,166
..............page:157-159
Electrodeposition of Nickel and Its Composite Coatings in Deep Eutectic Solvents
HU Jiang-hua;,LIU Dong-guang;
HU Jiang-hua;,LIU Dong-guang;
..............page:160-163
Study on Sintering Method of Ceramic Substrates for Single Layer Ceramic Capacitors
LIU Xin;,LU Heng;,SONG Zi-feng;,ZHOU Feng;,ZHU Zhong-yong;
LIU Xin;,LU Heng;,SONG Zi-feng;,ZHOU Feng;,ZHU Zhong-yong;
..............page:164-166
Analysis of Nonmetallic Material Using in Astrospace
LI Jing-qiu;,LI Xiang-chen;,LIU Jian;,MAO Shu-qin;
LI Jing-qiu;,LI Xiang-chen;,LIU Jian;,MAO Shu-qin;
..............page:167-169
Study on Problem of LPCVD Back-seal Silicon Wafer Surface Particle
GAO Dan;,TONG Li-ying;
GAO Dan;,TONG Li-ying;
..............page:170-172
Process Research of Improving Gold Electrode Surface State
HUO Cai-hong;,LIU Xiang-wu;
HUO Cai-hong;,LIU Xiang-wu;
..............page:173-174,186
Bonding Process and Equipment of OGS
MA Zeng-gang;,SUN Hong-biao;
MA Zeng-gang;,SUN Hong-biao;
..............page:175-177
Reason Analysis of Bubbles in Capacitive Touch Screen Laminated with Liquid Optically Clear Adhesive
DUAN Qing-peng;,LIU Yong-li;,ZHAO Nai-hui;
DUAN Qing-peng;,LIU Yong-li;,ZHAO Nai-hui;
..............page:178-181
Selection and Application of Component in Electronic Assembly(continued)
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
..............page:182-186