1001-3474
2013 Issue 4
Development of Bonding Polarizing Film Equipment
DONG Yan-mei;WANG Jian-hua;WU Zheng-hai;SONG Jun-yao
DONG Yan-mei;WANG Jian-hua;WU Zheng-hai;SONG Jun-yao
..............page:250-252
Noise Reduction Technology of Lifting Mechanism of Radar Antenna Shelter
TIAN Yang;QIU Kun
TIAN Yang;QIU Kun
..............page:243-245
Process Optimization of Gold Wire Thermo-sonic Wedge Bonding of Millimeter Wave RF Interconnection
REN Rong;LU Shao-ying;JIN Jia-fu;XIE Qi-lin;QIU Ying-xia
REN Rong;LU Shao-ying;JIN Jia-fu;XIE Qi-lin;QIU Ying-xia
..............page:239-242
Process of Large Size Polycrystalline Silicon Ingot
ZHANG Jun-yan;XUE Yao-ping
ZHANG Jun-yan;XUE Yao-ping
..............page:246-249
pplication of Electropolishing Technology in SMT Laser-stencil
CAI Zhi-xiang;GONG Jin-chong
CAI Zhi-xiang;GONG Jin-chong
..............page:218-219,238
Wiring Design Technology for Vehicle Electronic Shelter
SUN Ya-zhen;CHEN Ming-yao
SUN Ya-zhen;CHEN Ming-yao
..............page:226-229
Technology for Improving Stack Precision of LTCC
TANG Xiao-ping;YAN Ying-zhan;ZHANG Chen-xi
TANG Xiao-ping;YAN Ying-zhan;ZHANG Chen-xi
..............page:220-222,229
Application of Space Camera Passive Thermal Control Implement about Multilayer Insulation Components
WANG Yu-long;SUN Shou-hong;LIU Jian;SUN Hui
WANG Yu-long;SUN Shou-hong;LIU Jian;SUN Hui
..............page:233-238
Application of Error Proof System to SMT
CHEN Ling-ling
CHEN Ling-ling
..............page:230-232
Typical Failure Modes of PCB Electrical Connectors for Spaceflight Electronic Products
zhang bin bin ; yang meng ; wan cheng an
zhang bin bin ; yang meng ; wan cheng an
..............page:209-213
..............page:223-225,249
..............page:196-199
Applicability Evaluation of Solder Reductant
LU Qing-cui;WANG Xin;WU Jin-chang
LU Qing-cui;WANG Xin;WU Jin-chang
..............page:214-217,229
Effect of Thermal Cycles on Conductivities of SnCuTi/Cu Through-hole Solder Joints
PENG Xin-qiang;WEI Guo-qiang;DU Kun;GAO Hong-yong
PENG Xin-qiang;WEI Guo-qiang;DU Kun;GAO Hong-yong
..............page:191-193,208
Solution of PCBA Problem Troubles During ICT
RUAN Wei-dong
RUAN Wei-dong
..............page:204-208
Reliability Study on LCCC Solder Joint
REN Xiao-gang;XU Yan-dong;MA Lei;LIANG Zhen-yu;CUI Kai
REN Xiao-gang;XU Yan-dong;MA Lei;LIANG Zhen-yu;CUI Kai
..............page:200-203
Influence of Annealing Process on Quality of Vanadium-doped Semi-insulating 4H-SiC Wafer
WANG Li-zhong;WANG Ying-min;LI Bin;MAO Kai-li;XU Wei;HOU Xiao-rui
WANG Li-zhong;WANG Ying-min;LI Bin;MAO Kai-li;XU Wei;HOU Xiao-rui
..............page:194-195,213