Electronics Process Technology 2013 Issue 3 Process Problems of Influencing on Reuse Chip Resistor Reliability

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics Process Technology
1001-3474
2013 Issue 3

..............page:129-132

BGA Stress Reliability Problems and Solutions
HAO Lin;JIA Zhong-zhong;WANG Yu

..............page:136-141

..............page:133-135,166

Measurement of Junction Temperature of Multi-chip Surface Mounted LED Device
LIU Dong-yue;PENG Hao;RU Zhi-qin;HUANG Jie;XV Li-sheng

..............page:145-147,180

Preliminary Study of Semi-additive Process for Fine Line
FU Hai-tao;LUO Yong-hong;YAN Hui-juan;CHEN Pei-feng;CHANG Ming;HUANG Wei

..............page:151-154

Causes of Tombstoning in Vapor Phase Reflow Soldering
WANG Xiu-li;DING Ying;YAN Gui-sheng;YANG Shu-juan

..............page:158-160,177

Influence of Soldering Method on Soldering Quality
MAO Shu-qin;LIU Jian;WU Yan-xiong

..............page:148-150

Intelligent Substation Technology
GUO Zeng-liang

..............page:187-190

Development of Vertical Shear Plating Equipment for Wafer
DUAN Jin-sheng;WEI Hong-jun;HU Zi-qing

..............page:178-180

..............page:161-166

..............page:167-169,186

Application of Selective Conformal Coating
WANG Yi-mei;WANYAN Yu-ren

..............page:155-157,177

..............page:174-177

..............page:170-173

..............page:142-144,173

..............page:181-182,190

..............page:183-186