1001-3474
2013 Issue 2
Mechanical Behaviors of Sn-based Solder Joints in Electronic Packaging and Assembly
an rong ; hang chun jin ; liu wei ; zhang wei ; tian yan hong ; wang chun qing
an rong ; hang chun jin ; liu wei ; zhang wei ; tian yan hong ; wang chun qing
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Research on dielectric properties of Al2O3 bulks manufactured by plasma spray
li yuan sheng ; yang zhong yuan ; zhao dan ; jin mou ping ; chen yan qing
li yuan sheng ; yang zhong yuan ; zhao dan ; jin mou ping ; chen yan qing
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Low Temperature Assembly Process of BGA
sun shou hong ; wang yu long ; shi bao song
sun shou hong ; wang yu long ; shi bao song
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Analysis and Solution of Poor Flatness of Combined Antenna
zhu xin min ; zhang dong feng ; jia chao ying
zhu xin min ; zhang dong feng ; jia chao ying
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Fabrication of Sb2Te3 Film Using Magnetic Sputtering Technology
hang chun jin ; fu ming liang ; sun shao peng ; wang shu feng ; wang chun qing
hang chun jin ; fu ming liang ; sun shao peng ; wang shu feng ; wang chun qing
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Distribution of Solder Void in BGA and Reasons Research
wang hui fen ; xie xiao feng ; wu jin chang
wang hui fen ; xie xiao feng ; wu jin chang
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Effect of Jig Shape on Surface Quality of Silicon Polished Wafers
yang hong xing ; chen ya zuo
yang hong xing ; chen ya zuo
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Developments of Electromigration of Sn-Ag-Cu Lead-free Interconnect Solder Joints
wang ling ; liu xiao jian ; wan chao
wang ling ; liu xiao jian ; wan chao
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Preparation of heat-proof and insulating potting material
wang ying ; zhou chun yan
wang ying ; zhou chun yan
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through-hole reflow soldering processes
liu shao min
liu shao min
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Application of Laser Induced Forward Transfer Technology in Field of Electronics Fabrication
liu wei ; wang chun qing ; tian yan hong ; zuo guang bin ; ye jiao tuo
liu wei ; wang chun qing ; tian yan hong ; zuo guang bin ; ye jiao tuo
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Study of Performance of Chromium-Free Alodine Film on Al-alloy
liu dong guang ; hu jiang hua ; lu hai yan ; wu xiao xia
liu dong guang ; hu jiang hua ; lu hai yan ; wu xiao xia
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Investigation Progress of Microstructure and Properties of Mixed BGA Solders
jiang qing lei ; zhang zuo ; liu gang ; yu chun yu
jiang qing lei ; zhang zuo ; liu gang ; yu chun yu
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