Electronics Process Technology 2012 Issue 1 Vision Positioning System of Flip Chip Bonder

Vision Positioning System of Flip Chip Bonder
zhang cai yun ; lang peng ; wang xiao kui ; di xi yuan

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mei ya ke ji xie shou dimadispensetechnology ji interflux/interselect que li zhan lue he zuo huo ban guan xi

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jin zuo hao jie peng cheng duo guan fang di er jie hkpca ipcshow shou gong han jie jing sai 2011 nian du zong jue sai guan jun huo de zhe

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ipc zhong wen biao zhun mu lu

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ipc zhong guo cheng du ban shi chu luo cheng qing dian yi shi zai cheng du long zhong ju xing

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ipc zhong guo pei xun ke cheng shuo guo lei lei

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dian zi zhuang lian gong yi ji shu cong shu jie shao

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ji shu yan tao hui lun wen zheng ji kai shi liao !

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Effects of Silica Fume on Potting Material of Epoxy Resin
ye bing zuo ; chen ping ; ma yuan

..............page:57-59

ri lian ke ji zhong qing fen gong si kai ye

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Analysis and Countermeasures for Assembly Reliability of Lead-free Devices
sun shou hong ; shi bao song ; zhang yu juan

..............page:31-33,56

Study on Process Optimization for Hot Bar Soldering
yang fang ; wang hui fen ; wu jin chang

..............page:14-17

A Novel RFID UHF Antennas Based on Company＇s Logo
jiang qing qing ; an bing ; zhang jia bo

..............page:4-6

Application of Muti-Diamond Wire Saw to Slice SiC Crystal
xu wei ; wang ying min ; mao kai li ; jiang zhi yan ; zhou li ping

..............page:50-52

ipc2011 nian re mo bei shou gong han jie jing sai - hua nan sai qu zui jia gong yi jiang

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Impact of Plasma Cleaning on Reliability of Wire Bonding
luo hong zuo ; cai cheng de ; huang xin zhang

..............page:26-30

ipc2011 nian re mo bei shou gong han jie jing sai zong jue sai you sheng zhe fu chu shui mian

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Effect Factors on Quality of Board Level Assembly
wang yu ming ; cao you wang ; wang bei bei ; wu wang zuo

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Study on Reactive Ion Etching Technology of Au Thin Film
zhao fei ; dang yuan lan

..............page:53-56

Assembly Technology and Quality Control of BGA
jiang ping

..............page:34-37

Investigation of Reverse Current for Crystalline Silicon Solar Cells
wang hai dong ; wang he ; yang hong

..............page:7-9,17

Effect of Cooling Rate on Solder Joint Quality In Lead-free Reflow Soldering
shi jian wei

..............page:60-62

Applied Study of Au-Si Eutectic Bonding Process
yuan hui

..............page:18-20,37

Simulation for Lead-free Solder in Ten-zone Reflow Soldering of PCB Assembly
li na ; yu xin hong

..............page:10-13,49

ipc tui chu e ban ying wen za zhi ipcoutlook

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ipc fa bu 2011 nian 11 yue fen pcb xing ye diao cha jie guo

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Exploitation and Study of Embedded Inductor Process
yan hui juan ; wu jin hua ; luo yong hong ; chen pei feng

..............page:21-25,30

Analysis of Laser Welding Cracks on Kovar Alloy Box
lei dang gang

..............page:45-49

ipc yu npl jiang zai ipcapexe po2012 ju ban gong yi que xian zhen duan yan tao hui

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jian shu shi zai gong chuang wei lai 2011 guo ji xian lu ban ji dian zi zu zhuang zhan lan hui ji shi

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ipcapexexpo zhuan ye fa zhan ke cheng jiang shi guan zhu xing ye mu qian mian lin de tiao zhan ipc she jiao wang luo ping tai bang zhu zhan kai dui hua

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feng zhuang ke yi cheng shou duo da de ying bian -ipc jedec-9707 de qiu mian wan qu ce shi neng gou jian shao ji xie shi xiao

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ipc tui chu xin de yin zhi dian zi guan li wei yuan hui

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ri lian gong si smt xue shu nian hui shang zai huo shu rong

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ipc gong bu 2012 nian dong ji wang luo yan tao hui ji hua hui yi nei rong bao kuo rou xing ban wei xiu fan gong han jie he zu zhuang que xian yi ji xie xing han jie

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Research of Automatic Mounting System Based on ACM
dong yi

..............page:38-40

an bi ang tui chu xin xing iflex tie zhuang ping tai

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ipc-t-50h dian zi dian lu hu lian yu feng zhuang shu yu ji ding yi dai xu

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