Electronics Process Technology 2010 Issue 6 Gold Wire Thermosonic Ball Bonding Technology

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronics Process Technology
1001-3474
2010 Issue 6

..............page:334-340,345

Investigation on wetting and reliability of low Ag lead free solders
FU Yong-gao;WANG Hong-qin;WANG Ling;DU Bin;WANG Peng-cheng;WAN Chao;SONG Zhi-wei

..............page:320-323,368,372

Quality Control Process for Small Chip Component
ZHAO Wen-jun;SHI Jian-wei;DU Bin;WANG Peng-cheng;WANG Ling

..............page:324-331

xin xi dong tai

..............page:后插5-后插15

FOG Manufacuring Technology and Key Techniques
ZHANG Yong-feng;JIAN Wei-juan;HE Yong

..............page:358-361

Research Progress of Waveguide Optical Interconnection
YAN Rong;WU Feng-shun;LIU Hui;MO Li-ping;JIANG Xue-fei;PENG Wei-hong

..............page:311-314,319

..............page:354-357

Design of Array Sealing in Parallel Seam Sealer
FENG Zhe;LI Xiao-yan;LIU Xiao-dong;DU Hu-ming;LIU Chang

..............page:365-368

Study of Lead-forming Technology for Fine Pitch QFP
WANG Yu-long;SUN Shou-hong

..............page:341-345

..............page:369-372

Thermal Cycling and four-points Bending Reliable Research on Lead-free BGA Joint
WANG Ling;WANG Hong-qin;FU Yong-gao;WANG Peng-cheng;DU bin;WAN Chao;SONG Zhi-wei

..............page:332-333,353

Development of LTCC Punching Machine
YANG Wei;WANG Hai-zhen;WU Jing-jing;SHEN Geng-yao;ZHANG Yong-cong

..............page:362-364

Research on Method of Selective Region Doping
LIU Jun;YUAN Xiao-dong;LUO Zhang

..............page:315-319

..............page:346-349

..............page:350-353