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Electronics Process Technology
1001-3474
2010 Issue 3
Application of Tension Control System for Film Winding
ren jian ; jin jian ding
..............page:172-176
Study of Quality and Performance of Ni-inner Paste of B MLCC
zhang shao ge ; meng shu zuo ; fu yi mei
..............page:177-179
Physical Verification in Electronic Products Panel Controller Chip
wang ren ping ; shi long zhao
..............page:168-171
Radiation Versus Convection for SMT/BGA Rework
lang xiang hua
..............page:158-160
Selection of Adhesive and Coating Process in Electronic Assembly
shi jian wei ; xu yuan ; wang jian bin
..............page:182-184
Impact of Solder Paste Quality on Reliability of Solder Joint In Lead-free Micro-assembly
fan rong rong ; liu zhe ; qiu hua sheng ; sun lei ; zhong hong ji ; zeng fu lin
..............page:144-149,171
Au20Sn Solder Foil and Its Application
huang liang ; chen wei min ; an bing ; wu zuo ping
..............page:125-127,131
Quality Control Methods and Measures of PCBA by Manual Placement
xu xiang ping ; jia xiao ping ; ren bo cheng
..............page:165-167
Research on Mounter Balance Optimization in SMT Production Line
liang wan lei ; zhao peng
..............page:161-164
mentor graphics gong si
..............page:185-186
Control System Design Based on Synqnet Bus
kang lian sheng ; jia xia yan
..............page:180-181
Study on Properties of Low-silver-content Sn-Ag-Cu Lead-free Solders
xu jin hua ; wu jia jia ; chen sheng ; ma zuo
..............page:141-143,157
Selection of Adhesive and Coating Process in Electronic Assembly
shi jian wei ; xu yuan ; wang jian bin
..............page:182-184
Radiation Versus Convection for SMT/BGA Rework
lang xiang hua
..............page:158-160
Physical Verification in Electronic Products Panel Controller Chip
wang ren ping ; shi long zhao
..............page:168-171
Application of Tension Control System for Film Winding
ren jian ; jin jian ding
..............page:172-176
Study of Quality and Performance of Ni-inner Paste of B MLCC
zhang shao ge ; meng shu zuo ; fu yi mei
..............page:177-179
Impact of Solder Paste Quality on Reliability of Solder Joint In Lead-free Micro-assembly
fan rong rong ; liu zhe ; qiu hua sheng ; sun lei ; zhong hong ji ; zeng fu lin
..............page:144-149,171
Au20Sn Solder Foil and Its Application
huang liang ; chen wei min ; an bing ; wu zuo ping
..............page:125-127,131
Quality Control Methods and Measures of PCBA by Manual Placement
xu xiang ping ; jia xiao ping ; ren bo cheng
..............page:165-167
Research on Mounter Balance Optimization in SMT Production Line
liang wan lei ; zhao peng
..............page:161-164
mentor graphics gong si
..............page:185-186
Control System Design Based on Synqnet Bus
kang lian sheng ; jia xia yan
..............page:180-181
Study on Properties of Low-silver-content Sn-Ag-Cu Lead-free Solders
xu jin hua ; wu jia jia ; chen sheng ; ma zuo
..............page:141-143,157
New Advanced Template-matching Algorithm
yang yong bing ; he xu zuo ; qi qi feng ; hu yue ming
..............page:128-131
Study on Mixed-signal Circuits Crosstalk and Substrate Coupling Noises
lv zuo ; chen rui
..............page:154-157
New Advanced Template-matching Algorithm
yang yong bing ; he xu zuo ; qi qi feng ; hu yue ming
..............page:128-131
Study on Mixed-signal Circuits Crosstalk and Substrate Coupling Noises
lv zuo ; chen rui
..............page:154-157
Electromagnet-assisted Nanoimprint Technology
duan zhi yong ; luo kang
..............page:132-134,140
Synthesis Grown and Development of InP Crystal
gao hai feng ; yang rui xia ; yang fan ; sun nie feng ; zhou xiao long
..............page:135-140
Electromagnet-assisted Nanoimprint Technology
duan zhi yong ; luo kang
..............page:132-134,140
Synthesis Grown and Development of InP Crystal
gao hai feng ; yang rui xia ; yang fan ; sun nie feng ; zhou xiao long
..............page:135-140