1001-3474
2009 Issue 2
..............page:123-124
Choice of Soldering Equipment in Electronic Assembly
SHI Jian-wei;Han Zhong-jun;CHEN Wan-hua;LI Zhi-wen
SHI Jian-wei;Han Zhong-jun;CHEN Wan-hua;LI Zhi-wen
..............page:119-122
EMC Technology of Reinforcement Computer Application
WANG Xiao-dong
WANG Xiao-dong
..............page:116-118,122
Movement Platform Design of Green Ceramic Tape Punching Machine
WANG Gui-ping;DONG Yong-qian;TIAN Fang;DI Xi-yuan
WANG Gui-ping;DONG Yong-qian;TIAN Fang;DI Xi-yuan
..............page:113-115
Application of Vision System to Ultrasonic Drilling Machine
LI Jun-ling;LI Lan;SUN Xiao-bo;YANG Jing
LI Jun-ling;LI Lan;SUN Xiao-bo;YANG Jing
..............page:110-112
Improvement of Sorting and Testing technics of Capacitor Sorting Machine
WU Zhen-feng;LI Xiang-dong
WU Zhen-feng;LI Xiang-dong
..............page:107-109,112
Research on Manufacturing Process of the High- pass Filter With High- accuracy
FENG De-gui;LI Jun-tao
FENG De-gui;LI Jun-tao
..............page:104-106
..............page:99-103
Performance and Substitute for Deca- BDE Flame Retardant
YU Yang;LIU Yan
YU Yang;LIU Yan
..............page:96-98
Effect Factors Analysis of Wire Bonding Quality on Microwave Circuit
HU Rong;XU Rong-qing;LI Yue
HU Rong;XU Rong-qing;LI Yue
..............page:92-95
..............page:89-91,95
Microwave Monolithic Ceramic Circuit(MMCC) Technology
MAO Xiao-hong;GAO Neng-wu;XIANG Bo;QIN Yue-li
MAO Xiao-hong;GAO Neng-wu;XIANG Bo;QIN Yue-li
..............page:86-88
PCA design for Miniature Components and Lead Free Assembly
LIU Yan-xin;BAI Yun
LIU Yan-xin;BAI Yun
..............page:82-85
Consolidated Technics of PCB
MAO Shu-qin;ZHANG Wei;LI Jing-qiu
MAO Shu-qin;ZHANG Wei;LI Jing-qiu
..............page:79-81
Research of PBGA Voids in Lead- Free reflow Process
SUN Lei;LIU Zhe;FAN Rong-rong
SUN Lei;LIU Zhe;FAN Rong-rong
..............page:74-78
Influence of Aging Treatment on Microstructure and Shear Property of Sn -9Zn/Cu Brazed Joint
Lu Juan;ZHAO Mai-qun;LU Jia-fei;WANG Xiu-chun;Lu Hai-xia
Lu Juan;ZHAO Mai-qun;LU Jia-fei;WANG Xiu-chun;Lu Hai-xia
..............page:70-73
Soft- switch Technology Based on High- frequency Link Parallel Inverter
LI Yi-hai;LI Xian-xiang;CHEN Li-ding
LI Yi-hai;LI Xian-xiang;CHEN Li-ding
..............page:66-69
Research on Reliability of SMT Solder Joint in Dynamic Tensile Load
WANG Yong;LEI Yong-ping;LIN Jian;ZHANG Zhi-zheng;ZHAO Hai-yan
WANG Yong;LEI Yong-ping;LIN Jian;ZHANG Zhi-zheng;ZHAO Hai-yan
..............page:63-65,69