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Electronics Process Technology
1001-3474
2008 Issue 3
Foreign Literature Guide
..............page:184
Design of the Cam in Cutting Machine of Capacitor
JING Xiao-li;YA Gang
..............page:171-173
Research on Turning Performance of Engineering Plastics
MA Dong
..............page:168-170
Protection Design of High Power Klystron Transmitter
HE Qi-wen
..............page:164-167
Humanistic Design of Electronic Special Equipment
JIN Jian-ding
..............page:160-163
Developing of X7R Ceramic Material for Ultra-low Temperature Sintering
SONG Yong-sheng;FU Zhen-xiao
..............page:157-159
GPS Receiver Debugging Technology Research
WEI Dong;LIU Xiao-hui
..............page:153-156
Manufacturing Technology of Co-located Filter
ZHANG Su-rong
..............page:149-152
Improve the Reliability of BGA Solder Joint
LIANG De-cai;LIU Ji-fen;ZHOU Jing-song
..............page:146-148
Research on Latch-up Effect in CMOS and the Prevention
LONG En;CHEN Zhu
..............page:142-145
Lead-free Rework Technology of BGA
LIANG Wan-lei
..............page:139-141,145
Investigation of Flip-chip Underfill Flow With Different Solder Bump Arrangements
ZHANG Liang-ming;WAN Jian-wu
..............page:134-138
Requirements and Test Methods for Halogen-free for Electronic Products
LIU Zi-lian;LUO Dao-jun
..............page:131-133
Application and Development of Pulse-technology
JING Cui;ZHANG Lei
..............page:128-130,167
Design of Product Measurement Software Based on Images
HUANG Jian-rong;HU Yue-ming;QI Qi-feng
..............page:125-127,152
Solder Defects and Solutions in Lead-free Soldering Technology
SHI Jian-wei
..............page:180-183
Backstepping Calculation of Filtering Unit
BI Wen-lan;HU Mao-xing;HUANG Min-sheng
..............page:174-176,183