1001-3474
2007 Issue 4
..............page:247-248
..............page:246
Make assembly job better in innovation(to be continued)
CHEN Zheng-hao
CHEN Zheng-hao
..............page:243-245
Research and Applications of Organic Light-emitting Display
YANG Ding-yu;JIANG Meng-heng
YANG Ding-yu;JIANG Meng-heng
..............page:239-242
..............page:236-238
Application and Developing of CAPP System
Lii Zi-hong;ZHANG Jun-ling;GUO Jing-juan
Lii Zi-hong;ZHANG Jun-ling;GUO Jing-juan
..............page:233-235
Improvement and Innovation of PZP-1220B Model Cutting Machine of Polaroid
QIAO Ai-hua;SONG Jun-yao;LIU Ke-ke
QIAO Ai-hua;SONG Jun-yao;LIU Ke-ke
..............page:231-232,235
Effects of Process Parameters on Joint Properties in Micro-resistance Spot welding of Beryllium Copper
XU Chun-rong;Zhou Yun-hong;XING Li
XU Chun-rong;Zhou Yun-hong;XING Li
..............page:227-230
Main Points of High-Speed PCB Design
LIU Wei-xiong
LIU Wei-xiong
..............page:224-226
..............page:221-223,226
..............page:218-220
BGA Rework Technics
HAN Man-lin;ZHAO Xiong-ming
HAN Man-lin;ZHAO Xiong-ming
..............page:214-217
An Upside-down Soldering Sealing Technique for MCM House Package
XIE Qi-lin;ZHU Qi-zheng
XIE Qi-lin;ZHU Qi-zheng
..............page:211-213
Progress on Technology of Wire Bonding
CHAO Yu-qing;YANG Zhao-jian;QIAO Hai-ling
CHAO Yu-qing;YANG Zhao-jian;QIAO Hai-ling
..............page:205-210
Prospect of Solder Paster Printing Technology
SHI Jian-wei;YANG Ji-feng;LI Jin;CHAI Yong
SHI Jian-wei;YANG Ji-feng;LI Jin;CHAI Yong
..............page:198-204
..............page:195-197
Present Situation and Trend of Electronic Scrap Processing
HAO Ying-zheng
HAO Ying-zheng
..............page:191-194
Finite Element Modeling of Dynamic Process of Copper wire Ultrasonic Wedge Bonding
ZONG Fei;TIAN Yan-hong;WANG Chun-qing
ZONG Fei;TIAN Yan-hong;WANG Chun-qing
..............page:187-190,220