1001-3474
2005 Issue 6
Ion Implantation in Fabricating Strained Si Channel CMOS
TAN Jing;LI Jing-chun;YANG Mo-hua;XUN Wan-jing;ZHANG Jing
TAN Jing;LI Jing-chun;YANG Mo-hua;XUN Wan-jing;ZHANG Jing
..............page:349-351,354
Control of The Adsorption State of Nano-Size Particles on Wafer in CMP
LI Wei-wei;LIU Yu-ling;ZHOU Jian-wei;WANG Juan
LI Wei-wei;LIU Yu-ling;ZHOU Jian-wei;WANG Juan
..............page:344-348
X- Ray Detection for Soldered Joint Defects in BGA Package
HU Yong-fang;XU Wei;YU Sheng-lin;XUE Song-bai
HU Yong-fang;XU Wei;YU Sheng-lin;XUE Song-bai
..............page:340-343,348
..............page:336-339,348
Mathematics Model of Reflow Soldering Temperature Field in SMT
HUANG Bing-yuan;SUN Gui-zhen;ZHANG Tong-ling
HUANG Bing-yuan;SUN Gui-zhen;ZHANG Tong-ling
..............page:333-335
Shear Strength and Creep Behavior of Sn-9Zn/Cu Solder Joints Prepared under New Fluxes
LIAO Fu-ping;HUANG Hui-zhen;ZHOU Lang
LIAO Fu-ping;HUANG Hui-zhen;ZHOU Lang
..............page:330-332,335
Design and Manufacture of SMT Production
SHI Dong-yao
SHI Dong-yao
..............page:326-329
Design of JR-28 Automatic Winding Machine for Metallized Film capacitors
WEI Hai-bin;ZHU Yue-hong;ZHENG Hai-hong
WEI Hai-bin;ZHU Yue-hong;ZHENG Hai-hong
..............page:323-325,329
Micro-Interconnects in Microwave MCM
QIU Ying-xia
QIU Ying-xia
..............page:319-322
Developing Trend of Bonding Technology for MEMS
ZHANG Dong-mei;YE Zhi-can;DING Gui-fu;WANG Hong
ZHANG Dong-mei;YE Zhi-can;DING Gui-fu;WANG Hong
..............page:315-318
Research of Activation Temperature of Rosin- Based Flux for Lead- Free Solder Paste
WANG You-shan;SHI Yao-wu;LEI Yong-ping;XIA Zhi-dong
WANG You-shan;SHI Yao-wu;LEI Yong-ping;XIA Zhi-dong
..............page:311-314,318
..............page:插页1-插页4
..............page:372
Classification of TFT - LCD Production Line and Equipment
ZHENG Sheng-de
ZHENG Sheng-de
..............page:365-369
Corrosion Mechanism of Gold Plating and Its Anticorrosivon
ZHAO Xiao-li;ZHANG Bao-gen
ZHAO Xiao-li;ZHANG Bao-gen
..............page:362-364,369
Application and Development of Neural Network
LIU Chun-ping
LIU Chun-ping
..............page:360-361
Discussion on the Surface Treatment and the Conduction Protecting Technique for the Surface of the Aluminum and Its Alloy
ZHANG Wen-chen
ZHANG Wen-chen
..............page:357-359
Production and Application of Thermal Ferrite
HU Shao-ming;REN Jun-feng;WANG Jun;CHEN Quan-zhou
HU Shao-ming;REN Jun-feng;WANG Jun;CHEN Quan-zhou
..............page:355-356
Research of the Eutectic Bonder Applied to High Power Die
CHANG Wen;ZHANG Cai-yun
CHANG Wen;ZHANG Cai-yun
..............page:352-354