1001-3474
2005 Issue 5
..............page:310-310
..............page:309
..............page:308-308
Comparison of LCD/PDP/OLED
ZHENG Sheng-de
ZHENG Sheng-de
..............page:304-307
Selective Conformal Coating Equipment
YANG Pei-lin;YAN Wen-e;TIAN Fang;LIAO Zhi-li
YANG Pei-lin;YAN Wen-e;TIAN Fang;LIAO Zhi-li
..............page:301-303
..............page:298-300
Measuring of Adhesion Atrength Between Thin Film and Substrate
CUI Cai-e;MIAO Qiang;PAN Jun-de
CUI Cai-e;MIAO Qiang;PAN Jun-de
..............page:294-297
..............page:292-293,197
Production of High Permeability and Low Attrition Mn Zn Ferrite
HU Shao-mign;WANG Jun;REN Jun-feng;CHEN Quan-zhou;DONG Yan-yang
HU Shao-mign;WANG Jun;REN Jun-feng;CHEN Quan-zhou;DONG Yan-yang
..............page:289-291
Effects of Sol - Gel Process on the Preparation of Nano- Sized Zirconium Rich PZT
MU Guo-hong;YANG Shi-yuan;WANG Jun-xia;LIU Wei;ZHANG Fu-ping
MU Guo-hong;YANG Shi-yuan;WANG Jun-xia;LIU Wei;ZHANG Fu-ping
..............page:285-288,291
SMT Productive Practice
WANG Wenbo
WANG Wenbo
..............page:282-284
The Study on the Design Technology and Appliance of Multi - layer - Chip and Low Magnetic Transformer
WANG Yong-ming;ZHANG Shi-jun;LONG Tao
WANG Yong-ming;ZHANG Shi-jun;LONG Tao
..............page:278-281,284
Study and Application of SnZn- based Solder
ZHANG Xi-min;HU Qiang;XU Jun;SONG De-jun
ZHANG Xi-min;HU Qiang;XU Jun;SONG De-jun
..............page:273-277
Study on the Process Technology of the Preparation of the Multilayer Microstrip Circuit Board
YANG Wei-sheng
YANG Wei-sheng
..............page:267-272
An Anti- jamming Design and Self- made Method of Microcomputer PCB
SHI Da-fa;WANG Hui
SHI Da-fa;WANG Hui
..............page:264-266
Effect of Nitrogen Protection on Pulling Strength of QFP Solder Joint in Lead- free Reflow Sodering
SHI Jian-wei;YUAN He-ping;ZHOU Hui-lin;WANG Hong-ping
SHI Jian-wei;YUAN He-ping;ZHOU Hui-lin;WANG Hong-ping
..............page:259-263
..............page:254-258,263
Study on the Configuration and the Interfacial Metallurgic Characteristics of Ultrasonic Wire Bonds
JI Hong-jun;LI Ming-yu;WANG Chun-qing
JI Hong-jun;LI Ming-yu;WANG Chun-qing
..............page:249-253