1001-3474
2004 Issue 2
..............page:92-92
Probe Specialized Terms of SMT and Micro-electronics Packaging
kuang yan xiang ; zhu song chun
kuang yan xiang ; zhu song chun
..............page:89-91
..............page:86-88
..............page:84-85,88
Research of A Special Spring
li ji yuan ; zhao zheng hong ; zhu zhao bin ; wu ya bing
li ji yuan ; zhao zheng hong ; zhu zhao bin ; wu ya bing
..............page:79-83
A New Type of Wave Soldering Unit Which Suits Both the Long Pin and Short Pin Insertion Technology
cao jie ; zhang guo zuo
cao jie ; zhang guo zuo
..............page:76-78
Assembly of Small Cable Connector
yang guang yu
yang guang yu
..............page:74-75,78
Application of DFM Software to PCB Design
jia bian fen ; shen gang
jia bian fen ; shen gang
..............page:71-73
Thermal Design of Electronic Circuit
hou chuan jiao ; yang zhi min
hou chuan jiao ; yang zhi min
..............page:68-70
Microstructure Evolution in Lead-free Solder Joints After Wave Soldering and Reflow Soldering
qi lin ; zhao jie ; wang lai ; yang fu hua ; yin song he
qi lin ; zhao jie ; wang lai ; yang fu hua ; yin song he
..............page:64-67
Reflow Technology and Equipment in the Lead-free Assembly
sheng ju yi ; xu guan jie
sheng ju yi ; xu guan jie
..............page:60-63,67
..............page:55-59
Review of JIS Z 3198:Test Method for Lead-free Solders
wang chun qing ; li ming yu ; tian yan hong ; kong ling chao
wang chun qing ; li ming yu ; tian yan hong ; kong ling chao
..............page:47-54